參數(shù)資料
型號(hào): LTC2215IUP#TR
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
封裝: 9 X 9 MM, PLASTIC, MO-220WNJR-5, QFN-64
文件頁(yè)數(shù): 24/36頁(yè)
文件大小: 1703K
代理商: LTC2215IUP#TR
LTC2216/LTC2215
30
22165f
Grounding and Bypassing
TheLTC2216/LTC2215requiresaprintedcircuitboardwitha
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2216/LTC2215 has been optimized for a owthrough
layout so that the interaction between inputs and digital
outputs is minimized. Layout for the printed circuit board
should ensure that digital and analog signal lines are
separated as much as possible. In particular, care should
be taken not to run any digital track alongside an analog
signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2216/LTC2215 differential inputs should run
parallel and close to each other. The input traces should
be as short as possible to minimize capacitance and to
minimize noise pickup.
Heat Transfer
Most of the heat generated by the LTC2216/LTC2215 is
transferred from the die through the bottom-side exposed
pad. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. It is critical that the exposed pad and all
ground pins are connected to a ground plane of sufcient
area with as many vias as possible.
APPLICATIONS INFORMATION
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