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參數(shù)資料
| 型號： | LTC2165CUK#PBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| 封裝： | 7 X 7 MM, LEAD FREE, PLASTIC, MO-220WKKD-2, QFN-48 |
| 文件頁數(shù)： | 24/36頁 |
| 文件大?。?/td> | 663K |
| 代理商： | LTC2165CUK#PBF |
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LTC2165/LTC2164/LTC2163
30
216543f
GROUNDING AND BYPASSING
The LTC2165/LTC2164/LTC2163 requires a printed circuit
board with a clean unbroken ground plane in the first
layer beneath the ADC. A multilayer board with an internal
ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitors must be located as close to the pins as pos-
sible.Size0402ceramiccapacitorsarerecommended.The
traces connecting the pins and bypass capacitors must
be kept short and should be made as wide as possible.
Of particular importance is the capacitor between REFH
and REFL. This capacitor should be on the same side of
applicaTions inForMaTion
the circuit board as the A/D, and as close to the device
as possible. A low inductance interdigitated capacitor is
suggested for REFH/REFL if the sampling frequency is
greater than 110Msps.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
Most of the heat generated by the LTC2165/LTC2164/
LTC2163 is transferred from the die through the bottom-
sideexposedpadandpackageleadsontotheprintedcircuit
board. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. This pad should be connected to the
internal ground planes by an array of vias.
相關(guān)PDF資料 |
PDF描述 |
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| LTC2165IUK#TRPBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2163CUK#PBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2165CUK#TRPBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2163IUK#PBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2170CUKG-12#TRPBF | 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC52 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC2165IUK#PBF | 制造商:Linear Technology 功能描述:IC ADC 16BIT PAR/SRL 125M 48QFN |
| LTC2165IUK#TRPBF | 制造商:Linear Technology 功能描述:IC ADC 16BIT PAR/SRL 125M 48QFN |
| LTC2170-12 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:12-Bit, 65Msps/40Msps/25Msps Low Power Quad ADCs |
| LTC2170-14 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Quad 14-Bit, 125Msps ADC with Integrated Drivers |
| LTC2170CUKG-12#PBF | 功能描述:IC ADC 12BIT SER/PAR 25M 52-QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應(yīng)商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個(gè)單端，雙極 |
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