參數(shù)資料
型號: LTC2157CUP-14#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
封裝: 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64
文件頁數(shù): 25/32頁
文件大小: 647K
代理商: LTC2157CUP-14#TRPBF
31
21576514f
LTC2157-14/
LTC2156-14/LTC2155-14
PACKAGE DESCRIPTION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
9 .00 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15 0.10
7.50 REF
(4-SIDES)
0.75 0.05
R = 0.10
TYP
R = 0.115
TYP
0.25 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 0.05
7.50 REF
(4 SIDES)
7.15 0.05
8.10 0.05
9.50 0.05
0.25 0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
相關PDF資料
PDF描述
LTC2157IUP-14#PBF 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2155IUP-14#TRPBF 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2156IUP-14#PBF 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2155CUP-14#PBF 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2156CUP-14#TRPBF 2-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
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