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參數(shù)資料
| 型號(hào)： | LT6559CUD#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/16頁 |
| 文件大小： | 0K |
| 描述： | IC AMP VIDEO TRPL 16-QFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 應(yīng)用： | 通用 |
| 電路數(shù)： | 3 |
| -3db帶寬： | 300MHz |
| 轉(zhuǎn)換速率： | 800 V/µs |
| 電流 - 電源： | 4.6mA |
| 電流 - 輸出 / 通道： | 100mA |
| 電壓 - 電源，單路/雙路(±)： | 4 V ~ 12 V，±2 V ~ 6 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
LT6559
15
6559f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00
± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45
± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25
× 45° CHAMFER
15
16
2
0.50 BSC
0.200 REF
2.10
± 0.05
3.50
± 0.05
0.70
±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
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