參數(shù)資料
型號(hào)： LPV3000
英文描述： 2W Power PHEMT
中文描述： 2W的功率PHEMT器件
文件頁數(shù)： 2/2頁
文件大?。?/td> 49K
代理商： LPV3000
Filtronic
Solid State
LP3000/LPV3000
2W Power PHEMT
Phone:
(408) 988-1845
Internet:
http://www.filtronicsolidstate.com
Fax:
(408) 970-9950
ABSOLUTE MAXIMUM RATINGS
(25
°
C)
SYMBOL
PARAMETER
V
DS
Drain-Source Voltage
V
GS
Gate-Source Voltage
I
DS
Drain-Source Current
I
G
Gate Current
P
IN
RF Input Power
T
CH
Channel Temperature
T
STG
Storage Temperature
P
T
Power Dissipation
RECOMMENDED CONTINUOUS
OPERATING LIMITS
SYMBOL
PARAMETER
V
DS
Drain-Source Voltage
V
GS
Gate-Source Voltage
I
DS
Drain-Source Current
I
G
Gate Current
P
IN
RF Input Power
T
CH
Channel Temperature
T
STG
Storage Temperature
P
T
Power Dissipation
G
XdB
Gain Compression
RATING
1
12V
-5V
2 x I
DSS
120 mA
1.2 W
175
°
C
-65/175
°
C
6.0W
3,4
RATING
2
8V
-1V
0.8 x I
DSS
40 mA
600 mW
150
°
C
-20/50
°
C
5.0 W
3,4
8 dB
NOTES:
1. Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
2. Recommended Continuous Operating Limits should be observed for reliable device operation.
3. Power Dissipation defined as: P
T
≡
(P
DC
+ P
IN
) - P
OUT
, where: P
DC
= DC bias power, P
OUT
= RF output power, and
P
IN
= RF input power.
4. Power Dissipation to be de-rated as follows:
5. Specifications subject to change without notice.
6.0
Example #1 :
V
DS
= 8V, I
DS
= 535 mA
P
IN
= P
OUT
= 0 dBm (quiescent condition):
P
T
= P
DC
= 4.28W
Max. continuous T
HS
= 25
°
C
Example #2:
V
DS
= 8V, I
DS
= 535 mA
P
IN
= 26.5 dBm P
OUT
= 33.5 dBm
P
T
= (4.28+0.45) - 2.24 = 2.49W
Max. continuous T
HS
= 88
°
C
HANDLING PRECAUTIONS:
PHEMT chips should be stored in a dry nitrogen environment until assembly. Care should be exercised during handling to
avoid damage to the devices. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of
storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500V), and further information
on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
ASSEMBLY INSTRUCTIONS:
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-
290
°
C; maximum time at temperature is 1 min. The recommended wire bond method is thermo-compression wedge
bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260
°
C.
APPLICATIONS NOTES AND DESIGN DATA:
Applications Notes are available from your local FSS Sales Representative, or directly from the factory. Complete design
data, including S-parameters, Noise data, and Large-Signal models, is available on 3.5” diskette, or may be down-loaded
from our Web Page.
DSS-027 WG
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