參數(shù)資料
型號: LPC2362FBD100
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: Single-chip 16-bit-32-bit MCU; up to 128 kB flash with ISP-IAP, Ethernet, USB 2.0 device-host-OTG, CAN, and 10-bit ADC-DAC
封裝: LPC2361FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,;LPC2362FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.htm
文件頁數(shù): 40/64頁
文件大?。?/td> 475K
代理商: LPC2362FBD100
LPC2361_62
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 25 October 2011
40 of 64
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
10.2 Deep power-down mode
V
DD(3V3)
= V
i(VBAT)
= 3.3 V; T
amb
= 25
C.
Total DC-to-DC converter supply current I
DD(DCDC)pd(3V3)
at different temperatures
in Power-down mode
Fig 6.
002aae051
200
600
400
800
0
temperature (
°
C)
40
85
35
10
60
15
V
DD(DCDC)(3V3)
= 3.3 V
V
DD(DCDC)(3V3)
= 3.0 V
I
DD(DCDC)pd(3v3)
(
μ
A)
V
DD(3V3)
= V
DD(DCDC)(3V3)
= 3.3 V; T
amb
= 25
C.
I/O maximum supply current I
DD(IO)
versus temperature in Deep power-down
mode
Fig 7.
temperature (
°
C)
40
85
35
10
60
15
002aae046
100
200
300
I
DD(IO)
(
μ
A)
0
V
DD(3V3)
= 3.3 V
V
DD(3V3)
= 3.0 V
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