參數(shù)資料
型號(hào)： LPC2103FA44
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC
中文描述： 32-BIT, FLASH, 70 MHz, RISC MICROCONTROLLER, PQCC44
封裝： PLASTIC, MS-018, SOT-187-2, LCC-44
文件頁(yè)數(shù)： 21/32頁(yè)
文件大?。?/td> 128K
代理商： LPC2103FA44
LPC2101_02_03_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 18 January 2006
21 of 32
Philips Semiconductors
LPC2101/2102/2103
Single-chip 16-bit/32-bit microcontrollers
7.
Limiting values
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2]
Core and internal rail.
[3]
External rail.
[4]
On ADC related pins.
[5]
Including voltage on outputs in 3-state mode.
[6]
Only valid when the V
DD(3V3)
supply voltage is present.
Not to exceed 4.6 V.
[7]
[8]
Per supply pin.
[9]
The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
Table 4:
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol
Parameter
V
DD(1V8)
supply voltage (1.8 V)
V
DD(3V3)
supply voltage (3.3 V)
V
DDA
analog 3.3 V pad supply voltage
V
i(VBAT)
input voltage on pin VBAT
V
IA
analog input voltage
V
I
input voltage
Limiting values
Conditions
Min
Max
+2.5
+3.6
4.6
4.6
5.1
6.0
Unit
V
V
V
V
V
V
[2]
0.5
[3]
0.5
0.5
0.5
[4]
0.5
[5] [6]
0.5
for the RTC
5 V tolerant I/O
pins
other I/O pins
[5]
0.5
[8]
-
V
DD
+ 0.5
[7]
V
100
[9]
100
[9]
125
1.5
I
DD
I
SS
T
stg
P
tot(pack)
supply current
ground current
storage temperature
total power dissipation (per package)
mA
mA
°
C
W
[10]
-
[11]
40
based on package
heat transfer, not
device power
consumption
-
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