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參數(shù)資料
| 型號： | LPC2102FHN48,551 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 28/37頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ARM7 MCU FLASH 16K 48-HVQFN |
| 標(biāo)準(zhǔn)包裝： | 260 |
| 系列： | LPC2100 |
| 核心處理器： | ARM7 |
| 芯體尺寸： | 16/32-位 |
| 速度： | 70MHz |
| 連通性： | I²C，Microwire，SPI，SSI，SSP，UART/USART |
| 外圍設(shè)備： | POR，PWM，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲(chǔ)器容量： | 16KB（16K x 8） |
| 程序存儲(chǔ)器類型： | 閃存 |
| RAM 容量： | 4K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.65 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 48-VFQFN 裸露焊盤 |
| 包裝： | 托盤 |
| 配用： | 568-4310-ND - EVAL BOARD LPC2158 W/LCD 568-4297-ND - BOARD EVAL LPC21XX MCB2100 MCB2103UME-ND - BOARD EVAL MCB2103 + ULINK-ME MCB2103U-ND - BOARD EVAL MCB2103 + ULINK2 622-1005-ND - USB IN-CIRCUIT PROG ARM7 LPC2K |
| 其它名稱： | 568-4689 935286982551 LPC2102FHN48-S |
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PIC18F85J90 FAMILY
DS39770C-page 34
2010 Microchip Technology Inc.
2.6
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
secondary
oscillator
(refer
to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times, and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC and PICmicro Devices”
AN849, “Basic PICmicro Oscillator Design”
AN943, “Practical PICmicro Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
2.7
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
FIGURE 2-4:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
OSC1
OSC2
T1OSO
T1OS I
Copper Pour
Primary Oscillator
Crystal
Timer1 Oscillator
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
T1 Oscillator: C1
T1 Oscillator: C2
(tied to ground)
Single-Sided and In-Line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
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