參數(shù)資料
型號(hào)： LPC11U12FHN33/201,
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 51/72頁(yè)
文件大小： 0K
描述： IC MCU 32BIT 16K 33HVQFN
產(chǎn)品培訓(xùn)模塊： Code Density for LPC11xx
標(biāo)準(zhǔn)包裝： 260
系列： LPC11Uxx
核心處理器： ARM? Cortex?-M0
芯體尺寸： 32-位
速度： 50MHz
連通性： I²C，Microwire，智能卡，SPI，SSP，UART/USART，USB
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，WDT
輸入/輸出數(shù)： 26
程序存儲(chǔ)器容量： 16KB（16K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 6K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 32-VQFN 裸露焊盤
包裝： 托盤
其它名稱： 568-8559
LPC11U1X
All information provided in this document is subject to legal disclaimers.
NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2.2 — 11 March 2014
55 of 72
NXP Semiconductors
LPC11U1x
32-bit ARM Cortex-M0 microcontroller
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Table 18.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
1 MHz to 5 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 300
39 pF, 39 pF
30 pF
< 300
57 pF, 57 pF
5 MHz to 10 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 200
39 pF, 39 pF
30 pF
< 100
57 pF, 57 pF
10 MHz to 15 MHz
10 pF
< 160
18 pF, 18 pF
20 pF
< 60
39 pF, 39 pF
15 MHz to 20 MHz
10 pF
< 80
18 pF, 18 pF
Table 19.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180
18 pF, 18 pF
20 pF
< 100
39 pF, 39 pF
20 MHz to 25 MHz
10 pF
< 160
18 pF, 18 pF
20 pF
< 80
39 pF, 39 pF
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