參數(shù)資料
型號: LMH6678LQ
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 通用總線功能
英文描述: Low Power 2-Channel Central-Office xDSL Driver
中文描述: DUAL LINE DRIVER, QCC24
封裝: 5 X 4 MM, LLP-24
文件頁數(shù): 3/17頁
文件大?。?/td> 1792K
代理商: LMH6678LQ
Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
J
= 25C, AV
CC1
= AV
CC2
=
+12V, DV
DD
= AV
DD
= +3.3V. DGND = AGND = 0V, 2/3 Power Mode. See (Note 9). (Continued)
Symbol
Parameter
Conditions
Min
(Note 6)
Typ
(Note 5)
±
580
Max
(Note 6)
Units
I
OUT
Output Current
V
IN_DIFF
=
±
2.4V
Sourcing, R
L
= 20
Sinking, R
L
= 20
mA
V
OC
V
OS
Power Supply
(Note 10)
,
(Note 11)
I
CC
AV
CC
Quiescent Supply Current
Full Power
2/3 Power
1/3 Power
Shutdown
I
DV
DV
DD
Quiescent Supply Current
Full Power
2/3 Power
1/3 Power
Shutdown
I
AV
AV
DD
Quiescent Supply Current
Logic Inputs
V
IH
Input High Voltage
V
IL
Input Low Voltage
I
IH
Input High Current
I
IL
Input Low Current
Charge Pump
f
CP
Charge Pump Frequency
V
HIGH
Charge Pump High Average
Voltage
V
LOW
Charge Pump Low Average
Voltage
Output Common Mode Voltage
Output Offset Voltage
5.89
40
6
0
6.05
+40
V
mV
B01
L
H
L
H
B01
L
H
L
H
B11
L
L
H
H
B11
L
L
H
H
B02
L
H
L
H
B02
L
H
L
H
B12
L
L
H
H
B12
L
L
H
H
28.6
18.6
9.2
33
22
12
0.2
36.9
25.4
14.3
.95
mA
mA
11
7
3
16
12
7
0.05
1.1
19
15
10.3
.14
1.4
All Power Modes
.8
mA
2.7
3.3
0
0.02
0.02
V
V
μA
μA
0.5
+0.5
+0.5
@
V
IH
= 3.3V
@
V
IH
= 0V
0.5
0.5
Measure at DRIVE at Full Power
Measure at CstoreH at Full Power
2.43
2.75
+14.6
MHz
V
Measure at CstoreL at Full Power
2.7V
V
Note 1:
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2:
Human body model, 1.5k
in series with 100pF.
Note 3:
Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150 C.
Note 4:
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
=
(T
J(MAX)
- T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC board. Die attach pad is electrically connected to AGND.
Note 5:
Typical Values represent the most likely parametric norm.
Note 6:
All limits are guaranteed by testing or statistical analysis.
Note 7:
Slew rate is the slowest of the rising and falling slew rates.
Note 8:
Machine Model, 0
in series with 200 pF.
Note 9:
Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
J
= T
A
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where T
J
>
T
A
.
Absolute maximum ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
Note 10:
Quiescent supply current specification apply for the condition of no input signal. See application section for information on power consumption as a
function of output power, power control bit settings and external resistor R
ADJ
.
Note 11:
“L” is V
IL
and “H” is V
IH
.
L
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