Electrical Characteristics V
DD
= 2.6V
(Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
A
=
25C. (Continued)
Note 11:
If the product is in Shutdown mode and V
exceeds 6V (to a max of 8V V
), then most of the excess current will flow through the ESD protection circuits.
If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is enabled when V
is greater than 5.5V and less than
6.5V, no damage will occur, although operation life will be reduced. Operation above 6.5V with no current limit will result in permanent damage.
Note 12:
All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4901IBL demo board (views featured
in the
Application Information
section) has two inner layers, one for V
DD
and one for GND. The planes each measure 611mils x 661mils (15.52mm x 16.79mm)
and aid in spreading heat due to power dissipation within the IC.
Note 13:
Maximum power dissipation in the device (P
) occurs at an output power level significantly below full output power. P
DMAX
can be calculated using
Equation 1 shown in the
Application Information
section. It may also be obtained from the power dissipation graphs.
Note 14:
The Exposed-DAP of the LDA10B package should be electrically connected to GND or an electrically isolated copper area. the LM4901LD demo board
(views featured in the
Application Information
section) has the Exposed-DAP connected to GND with a PCB area of 86.7mils x 585mils (2.02mm x 14.86mm) on
the copper top layer and 550mils x 710mils (13.97mm x 18.03mm) on the copper bottom layer.
Note 15:
The thermal performance of the LLP package (LM4901LD) when used with the exposed-DAP connected to a thermal plane is sufficient for driving 4
loads. The LM4901LD demo board (views featured in the
Application Information
section) can drive 4
loads at the maximum power dissipation point (1.267W)
without thermal shutdown circuitry being activated. The other available packages (MSOP & micro SMD) do not have the thermal performance necessary for driving
4
loads with a 5V supply and are not recommended for this application.
External Components Description
(
Figure 1
)
Components
1.
Functional Description
R
i
Inverting input resistance which sets the closed-loop gain in conjunction with R
f
. This resistor also forms a
high pass filter with C
i
at f
C
= 1/(2
π
R
i
C
i
).
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
highpass filter with R
i
at f
c
= 1/(2
π
R
i
C
i
). Refer to the section,
Proper Selection of External Components
,
for an explanation of how to determine the value of C
i
.
Feedback resistance which sets the closed-loop gain in conjunction with R
i
.
Supply bypass capacitor which provides power supply filtering. Refer to the
Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
Bypass pin capacitor which provides half-supply filtering. Refer to the section,
Proper Selection of External
Components
, for information concerning proper placement and selection of C
B
.
2.
C
i
3.
4.
R
f
C
S
5.
C
B
Typical Performance Characteristics
THD+N vs Frequency
at V
DD
= 5V, 8
R
L
, and PWR = 500mW
THD+N vs Frequency
at V
DD
= 3V, 8
R
L
, and PWR = 250mW
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