
Typical Performance Characteristics
MH Specific Characteristics (Continued)
Cross Talk vs Frequency
200428D5
V
DD = 3V, RL =8
,A
V = 15.6dB,
A = Left channel driven, right channel measured;
B = Right channel driven, left channel measured
200428D6
V
DD = 3V, RL =8
,A
V = 21.6dB,
A = Left channel driven, right channel measured;
B = Right channel driven, left channel measured
Power Dissipation Derating Curves
200428E4
V
DD = 5V, RL =8
,f
IN = 1kHz,
(from top to bottom at 40C): 3in x 3in four-layer PCB
with bottom and two inner layers connected to the package’s DAP,
1.5in x 1.5in two-layer PCB with bottom and top layer
planes connected to the package’s DAP
Application Information
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3W AND 4W LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendent on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1
trace resistance reduces
the output power dissipated by a 4
load from 2.1W to 2.0W.
This problem of decreased load dissipation is exacerbated
as load impedance decreases. Therefore, to maintain the
highest load dissipation and widest output voltage swing,
PCB traces that connect the output pins to a load must be as
wide as possible.
Poor power supply regulation also adversely affects maxi-
mum output power. A poorly regulated supply’s output volt-
age decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
LM4869
www.national.com
14