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  • 參數(shù)資料
    型號: LM12L438CIWMX
    廠商: NATIONAL SEMICONDUCTOR CORP
    元件分類: 模擬信號調(diào)理
    英文描述: SPECIALTY ANALOG CIRCUIT, PDSO28
    封裝: SOP-28
    文件頁數(shù): 72/80頁
    文件大?。?/td> 1552K
    代理商: LM12L438CIWMX
    80 Analog Considerations (Continued)
    The LM124348 is designed to operate from a single a5V
    power supply The LM12 L 438 is designed to operate from
    a single a33V supply The separate supply and ground
    pins for the analog and digital portions of the circuit allow
    separate external bypassing To minimize power supply
    noise and ripple adequate bypass capacitors should be
    placed directly between power supply pins and their associ-
    ated grounds Both supply pins are generally connected to
    the same supply source In systems with separate analog
    and digital supplies the DAS should be powered from the
    analog supply At least a 10 mF tantalum electrolytic capaci-
    tor in parallel with a 01 mF monolithic ceramic capacitor is
    recommended for bypassing each power supply The key
    consideration for these capacitors is to have the low series
    resistance and inductance The capacitors should be placed
    as close as physically possible to the supply and ground
    pins with the smaller capacitor closer to the device The
    capacitors also should have the shortest possible leads in
    order to minimize series lead inductance Surface mount
    chip capacitors are optimal in this respect and should be
    used when possible
    When the power supply regulator is not local on the board
    adequate bypassing (a high value electrolytic capacitor)
    should be placed at the power entry point The value of the
    capacitor depends on the total supply current of the circuits
    on the PC board All supply currents should be supplied by
    the capacitor instead of being drawn from the external sup-
    ply lines while the external supply charges the capacitor at
    a steady rate
    The DAS has two VDa and DGND pins on two sides of its
    package It is recommended to use a 01 mFplusa10 mF
    capacitor between pins 15 and 16 (VDa) and 14 (DGND)
    and a 01 mF capacitor between pins 28 (VDa) and 1
    (DGND) for the PLCC package The respective pins for the
    SO package are 21 and 22 (VDa) and 20 (DGND) 6 (VDa)
    and 7 (DGND) The layout diagrams in Section 88 show the
    recommended placement for the supply bypass capacitors
    88 PC BOARD LAYOUT AND GROUNDING
    CONSIDERATIONS
    To get the best possible performance from the LM12434
    and LM12 L 438 the printed circuit boards should have
    separate analog and digital ground planes The reason for
    using two ground planes is to prevent digital and analog
    ground currents from sharing the same path until they reach
    a very low impedance power supply point This will prevent
    noisy digital switching currents from being injected into the
    analog ground
    Figure 20 illustrates a favorable layout for ground planes
    power supply and reference input bypass capacitors
    Figure
    20a shows a layout using a 28-pin PLCC socket and
    through-hole assembly
    Figure 20b shows a surface mount
    layout for the same 28-pin PLCC package A similar ap-
    proach should be used for the SO package
    The analog ground plane should encompass the area under
    the analog pins and any other analog components such as
    the reference circuit input amplifiers signal conditioning cir-
    cuits and analog signal traces
    The digital ground plane should encompass the area under
    the digital circuits and the digital inputoutput pins of the
    DAS Having a continuous digital ground plane under the
    data and clock traces is very important This reduces the
    overshootundershoot and high frequency ringing on these
    lines that can be capacitively coupled to analog circuitry
    sections through stray capacitances
    The AGND and DGND in the LM12434 and LM12 L 438
    are not internally connected together They should be con-
    nected together on the PC board right at the chip This will
    provide the shortest return path for the signals being ex-
    changed between the internal analog and digital sections of
    the DAS
    It is also a good design practice to have power plane layers
    in the PC board This will improve the supply bypassing (an
    effective distributed capacitance between power and
    ground plane layers) and voltage drops on the supply lines
    However power planes are not essential as ground planes
    are for the performance of the DAS If power planes are
    used they should be separated into two planes and the
    area and connections should follow the same guidelines as
    mentioned for the ground planes Each power plane should
    be laid out over its associated ground planes avoiding any
    overlap between power and ground planes of different
    types When the power planes are not used it is recom-
    mended to use separate supply traces for the VAa and
    VDa pins from a low impedance supply point (the regulator
    output or the power entry point to the PC board) This will
    help ensure that the noisy digital supply does not corrupt
    the analog supply
    When measuring AC input signals with the DAS any cross-
    talk between analog inputoutput lines and the reference
    lines (IN0 – IN7 MUXOUTg SH INg VREFg) should be
    minimized Cross talk is minimized by reducing any stray
    capacitance between the lines This can be done by in-
    creasing the clearance between traces keeping the traces
    as short as possible shielding traces from each other by
    placing them on different sides of the AGND plane or run-
    ning AGND traces between them
    Figure 20 also shows the reference input bypass capacitors
    Here the reference inputs are considered to be differential
    The performance of the DAS improves by having a 01 mF
    capacitor between the VREFa and VREFb and by bypass-
    ing in a manner similar to that described in Section 87 for
    the supply pins When a single ended reference is used
    VREFb is connected to AGND and only two capacitors are
    used between VREFa and VREFb (01 mF a 10 mF) It is
    recommended to directly connect the AGND side of these
    capacitors to the VREFb instead of connecting VREFb and
    the ground sides of the capacitors separately to the ground
    planes This provides a significantly lower-impedance con-
    nection when using surface mount technology
    Figure 21 is intended to give a general idea of how the DAS
    should be wired and interfaced to a mC that operates in the
    Standard Interface mode All necessary analog and digital
    power supply and voltage reference bypass capacitors are
    shown A voltage reference of 4096V generated by the
    LM4040-41 is connected to the VREFa of the DAS and the
    VREFb is connected to analog ground The serial interface
    pins P1 through P5 of the DAS are connected to the mC’s
    serial control lines and the interrupt pin of the DAS is wired
    directly to the interrupt of the mC In this diagram the DAS
    runs on a separate clock than the mC however in some
    applications the DAS analog clock (CLK) may be a deriva-
    tive of the mC’s clock
    74
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