參數(shù)資料
型號(hào)： LFX200C-3F900I
廠商： Lattice Semiconductor Corporation
英文描述： The ispXPGA architecture
中文描述： 在ispXPGA架構(gòu)
文件頁(yè)數(shù)： 15/89頁(yè)
文件大?。?/td> 941K
代理商： LFX200C-3F900I
Lattice Semiconductor
ispXPGA Family Data Sheet
15
Figure 17. ispXPGA PLL_RST and PLL_FBK Generation
Clock Routing
The Global Clock Lines (GCLK) have two sources, their dedicated pins and the sysCLOCK circuit. Figure 18 illus-
trates the generation of the Global Clock Lines.
Figure 18. Global Clock Line Generation
sysIO Capability
All the ispXPGA devices have eight sysIO banks, where each bank is capable of supporting multiple I/O standards.
Each sysIO bank has its own I/O supply voltage (V
CCO
) and reference voltage (V
bank complete independence from the others. Each I/O is individually con
fi
gurable based on the bank’s V
V
REF
settings. In addition, each I/O has con
fi
gurable drive strength, weak pull-up, weak pull-down, or a bus-keeper
latch. Table 4 lists the number of I/Os supported per bank in each of the ispXPGA devices.
REF
) resources allowing each
CCO
and
Table 5 lists the sysIO standards with the typical values for V
CCO,
V
REF
and V
TT.
The TOE, JTAG TAP pins, PROGRAM, CFG0 and DONE pins of the ispXPGA device are the only pins that do not
have the sysIO capabilities. The TOE and CFG0 pins operate off the V
MOS standard corresponding to the device supply voltage. The TAP pins have a separate supply voltage (V
which determines the LVCMOS standard corresponding to that supply voltage.
CC
of the device, supporting only the LVC-
CCJ
),
There are three classes of I/O interface standards that are implemented in the ispXPGA devices. The
fi
rst is the un-
terminated, single-ended interface. It includes the 3.3V LVTTL standard along with the 1.8V, 2.5V, and 3.3V LVC-
MOS interface standards. Additionally, PCI and AGP-1X are subsets of this type of interface.
I/O/PLL_RST
I/O/PLL_FBK
From Routing
From Clock Net
To PLL
To PLL
PLL0
GCLK0
CLK_OUT0
SEC_OUT0
PLL1
CLK_OUT1
SEC_OUT1
GCLK1
PLL2
CLK_OUT2
SEC_OUT2
GCLK2
PLL3
CLK_OUT3
SEC_OUT3
GCLK3
PLL7
GCLK7
CLK_OUT7
SEC_OUT7
PLL6
CLK_OUT6
SEC_OUT6
GCLK6
PLL5
CLK_OUT5
SEC_OUT5
GCLK5
PLL4
CLK_OUT4
SEC_OUT4
GCLK4
CLK0
CLK1
CLK2
CLK3
CLK7
CLK6
CLK5
CLK4
From Routing
From Routing
From Routing
From Routing
相關(guān)PDF資料
PDF描述
LFX500C-4F900I The ispXPGA architecture
LFX1200C-03F900C Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
LFX1200C-03F900I The ispXPGA architecture
LFX1200C-04F900C The ispXPGA architecture
LFX500C-3F900C Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
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