參數(shù)資料
型號： LFX1200C-03F900I
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： The ispXPGA architecture
中文描述： FPGA, 3844 CLBS, 1250000 GATES, PBGA900
封裝： FPBGA-900
文件頁數(shù)： 9/89頁
文件大小： 941K
代理商： LFX1200C-03F900I
Lattice Semiconductor
ispXPGA Family Data Sheet
9
Set/Reset signal controls all the registers for each PFU. This common Set/Reset signal is composed of the logical
OR term of the Global Set/Reset signal (GSR) and the selected signal from routing. The polarity of this signal is not
controllable inside the PFU. Figure 9 shows the Clock Enable and Output Enable selection for each PFU.
Figure 7. Clock Selection per PFU
Figure 8. Set/Reset Selection per PFU
Figure 9. Clock Enable and Output Enable Selection per PFU
Programmable Input/Output Cell
The Programmable Input/Output Cell (PIC) is an essential part of the symmetrical architecture of the ispXPGA
Family. The PICs interface the PFUs and EBRs to the sysIO and sysHSI blocks of the device.
Each PIC contains two Programmable Input/Outputs (PIOs) with a total of 21 inputs and 10 outputs. There are 18
inputs from routing, two inputs from the sysIO buffers, and the Global Set/Reset signal. Four outputs of the PIC
connect to routing and two outputs are available as Output Enables for the tri-statable Long Lines. The remaining
four outputs feed the sysIO buffers directly (one output enable and one output to each). Each PIC associated with
a sysHSI block has four additional inputs and six additional outputs to support the sysHSI blocks. The four addi-
tional inputs come from the sysHSI block associated with the PIC. The four of the six additional outputs come from
the PIC outputs and feed the sysHSI block, while the remaining two outputs feed routing. Figure 10 shows the
block diagram of the PIC with the sysHSI block inputs and outputs.
From routing
PFUCLK0
PFUCLK1
CLK0
CLK1
CLK2
CLK3
CLK4
CLK5
CLK6
CLK7
4
From routing
Set/Reset
GSR
8
CEB1
OE
8
From routing
CEB0
8
From routing
相關(guān)PDF資料
PDF描述
LFX1200C-04F900C The ispXPGA architecture
LFX500C-3F900C Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
LFX1200C-3F900C Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
LFX500C-3F900I Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
LFX1200C-3F900I The ispXPGA architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFX1200C-03FE680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-03FEN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 1.25M Gt ispJTAG 1. 8V -3 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-03FEN680C2 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-04F900C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-04FE680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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