參數(shù)資料
型號(hào)： KMPC875CVR133
廠商： Freescale Semiconductor
文件頁數(shù)： 2/84頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC 133MHZ 256PBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC8xx
處理器類型： 32-位 MPC8xx PowerQUICC
速度： 133MHz
電壓： 3.3V
安裝類型： 表面貼裝
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-PBGA（23x23）
包裝： 托盤
MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
10
Freescale Semiconductor
Thermal Characteristics
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or VDDH).
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC875/MPC870.
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature 1 (standard)
1 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum temperatures are guaranteed as junction
temperature, TJ.
TA(min)
0°C
TJ(max)
95
°C
Temperature (extended)
TA(min)
–40
°C
TJ(max)
100
°C
Table 4. MPC875/MPC870 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
43
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
29
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
36
Four-layer board (2s2p)
RθJMA
3
26
Junction-to-board4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
20
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where
the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the
exposed pad without contact resistance.
RθJC
10
Junction-to-package top6
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
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KMPC875VR133 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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