參數(shù)資料
型號(hào): KMPC860SRCZQ50D4
廠商: Freescale Semiconductor
文件頁數(shù): 17/78頁
文件大小: 0K
描述: IC MPU POWERQUICC 50MHZ 357-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 50MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
24
Freescale Semiconductor
Bus Signal Timing
Figure 9 provides the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in
the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
Figure 9. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1
Figure 10 through Figure 13 provide the timing for the external bus read controlled by various GPCM
factors.
Figure 10. External Bus Read Timing (GPCM Controlled—ACS = 00)
CLKOUT
TA
D[0:31],
DP[0:3]
B20
B21
CLKOUT
A[0:31]
CSx
OE
WE[0:3]
TS
D[0:31],
DP[0:3]
B11
B12
B23
B8
B22
B26
B19
B18
B25
B28
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KMPC860SRCZQ66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC860SRVR80D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC860SRZQ50D4 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ Family Hardware Specifications
KMPC860SRZQ66D4 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Hardware Specifications
KMPC860SRZQ80D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324