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參數(shù)資料
| 型號(hào)： | KMPC859DSLZP66A |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 4/96頁(yè) |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 66MHZ 357PBGA |
| 標(biāo)準(zhǔn)包裝： | 2 |
| 系列： | MPC8xx |
| 處理器類型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 66MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 357-BBGA |
| 供應(yīng)商設(shè)備封裝： | 357-PBGA（25x25） |
| 包裝： | 托盤(pán) |
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MPC866/MPC859 Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers.
The VDDSYN power dissipation is negligible.
7.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA +(RθJA x PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ-TA) are possible.
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a
heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the
printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation
where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed-circuit board. It has been observed that the thermal performance of most plastic packages and especially
PBGA packages is strongly dependent on the board temperature; see Figure 3.
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