參數(shù)資料
型號(hào)： KMPC8360EZUALFHA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 96/102頁(yè)
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 667MHz
電壓： 1.3V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
93
Thermal Management Information
TJ = TB + (RθJB × PD)
where:
TJ = junction temperature (° C)
TB = board temperature at the package perimeter (° C)
RθJA = junction to board thermal resistance (° C/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made.
The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes.
22.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the Thermal
Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (° C)
TT = thermocouple temperature on top of package (° C)
Ψ
JT = junction-to-ambient thermal resistance (° C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
22.2.4
Heat Sinks and Junction-to-Ambient Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of the device. When a
heat sink is used, the thermal resistance is expressed as the sum of a junction to case thermal resistance and a case to ambient
thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (° C/W)
RθJC = junction-to-case thermal resistance (° C/W)
RθCA = case-to-ambient thermal resistance (° C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the airflow around the
device, the interface material, the mounting arrangement on printed-circuit board, or change the thermal dissipation on the
printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been simulated with a few
commercially available heat sinks. The heat sink choice is determined by the application environment (temperature, airflow,
adjacent component power dissipation) and the physical space available. Because there is not a standard application
environment, a standard heat sink is not required.
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