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參數(shù)資料
| 型號(hào)： | KGF1323F |
| 廠商： | OKI SEMICONDUCTOR CO., LTD. |
| 英文描述： | Power FET (Plastic Package Type) |
| 中文描述： | 功率場(chǎng)效應(yīng)管（塑料包裝型） |
| 文件頁(yè)數(shù)： | 1/6頁(yè) |
| 文件大?。?/td> | 73K |
| 代理商： | KGF1323F |
1/6
KGF1323F
electronic components
KGF1323F
This version: Jul. 1998
Previous version: Jan. 1998
Power FET (Plastic Package Type)
GENERAL DESCRIPTION
The KGF1323F, housed in a SOT-89 type plastic-mold package, is a KGF1323-based discrete
GaAs power FET that features high efficiency and high output power. The KGF1323F
specifications are guaranteed to a fixed matching circuit for 5.8 V and 850 MHz; external
impedance-matching circuits are also required. Specified specifically for analog cellular appli-
cations, the KGF1323F is ideally suited to applications requiring a transmitter-final-stage
amplifier for a cellular phone, such as AMPS and TACS. The device is directly mounted to a
printed circuit board.
FEATURES
Specifications guaranteed to a fixed matching circuit for 5.8 V and 850 MHz
High output power: 31.5 dBm (min.)
High efficiency: 70% (typ.)
Low thermal resistance: 14
°
C/W (typ.)
Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
E2Q0032-38-72
1.5
±
0.1
0.39
±
0.05
(Unit: mm)
4.5
±
0.1
4
±
0
2
±
0
1
±
0
+0.08
0.4
+0.08
0.4
+0.08
0.48
1.5
±
0.1 1.5
±
0.1
3
±
0.1
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5
m
m or more
1.6
+0.15
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