參數(shù)資料
型號: KGF1323
廠商: OKI SEMICONDUCTOR CO., LTD.
英文描述: Power FET(Plastic Package Type)
中文描述: 功率場效應(yīng)管(塑料包裝型)
文件頁數(shù): 1/7頁
文件大小: 83K
代理商: KGF1323
1/7
KGF1323
electronic components
KGF1323
This version: Jul. 1998
Previous version: Jan. 1998
Power FET(Plastic Package Type)
GENERAL DESCRIPTION
The KGF1323, housed in a SOT-89 type plastic-mold package, is a discrete UHF-band power FET
that features high efficiency and high output power. The KGF1323 specifications are guaranteed
to a fixed matching circuit for 5.8 V and 850 MHz; external impedance-matching circuits are also
required. Because of its high efficiency, high output power (more than 33 dBm), and plastic
package, the KGF1323 is ideal as a transmitter-final-stage amplifier for personal handy phones,
such as TDMA-type cellular phones.
FEATURES
High output power: 33 dBm (min.)
High efficiency: 70% (typ.)
Low thermal resistance: 23
°
C/W (typ.)
Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
E2Q0030-38-72
1.5
±
0.1
0.39
±
0.05
(Unit: mm)
4.5
±
0.1
4
±
0
2
±
0
1
±
0
+0.08
0.4
+0.08
0.4
+0.08
0.48
1.5
±
0.1 1.5
±
0.1
3
±
0.1
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5
m
m or more
1.6
+0.15
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