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參數(shù)資料
| 型號： | KAI-2001-AAA-CF-BA |
| 廠商： | KODAK IMAGE SENSOR SOLUTIONS |
| 元件分類： | CCD Image Sensor |
| 英文描述： | IMAGE SENSOR-CCD, 1600(H) X 1200(V) PIXEL, RECTANGULAR, THROUGH HOLE MOUNT |
| 封裝： | CERAMIC, DIP-32 |
| 文件頁數(shù)： | 32/48頁 |
| 文件大?。?/td> | 2270K |
| 代理商： | KAI-2001-AAA-CF-BA |
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STORAGE AND HANDLING
Storage Conditions
Description Symbol Minimum Maximum Units Notes
Storage
Temperature
TST
-55
80
°C
1
Humidity
RH
5
90
%
2
Notes:
1.
Long-term exposure toward the maximum temperature will accelerate color filter degradation.
2.
T=25C. Excessive humidity will degrade MTTF.
ESD
1. This device contains limited protection against
Electrostatic Discharge (ESD). CCD image sensors
can be damaged by electrostatic discharge. Failure
to do so may alter device performance and reliability.
2. Devices should be handled in accordance with strict
ESD procedures for Class 0 (<250V per JESD22
Human Body Model test), or Class A (<200V JESD22
Machine Model test) devices.
Devices are shipped in static-safe containers and
should only be handled at static-safe workstations.
3. See Application Note MTD/PS-0224 “Electrostatic
Discharge Control for Image Sensors” for proper
handling and grounding procedures. This application
note also contains recommendations for workplace
modifications for the minimization of electrostatic
discharge.
4. Store devices in containers made of electro-
conductive materials.
Cover Glass Care and Cleanliness
1. The cover glass is highly susceptible to particles and
other
contamination.
Perform
all
assembly
operations in a clean environment.
2. Touching the cover glass must be avoided
3. Improper cleaning of the cover glass may damage
these devices. Refer to Application Note MTD/PS-
0237 “Cover Glass Cleaning for Image Sensors”
Environmental Exposure
1. Do not expose to strong sun light for long periods of
time. The color filters and/or microlenses may
become discolored. Long time exposures to a static
high contrast scene should be avoided. The image
sensor may become discolored and localized
changes in response may occur from color
filter/microlens aging.
2. Exposure to temperatures exceeding the absolute
maximum levels should be avoided for storage and
operation. Failure to do so may alter device
performance and reliability.
3. Avoid sudden temperature changes.
4. Exposure to excessive humidity will affect device
characteristics and should be avoided. Failure to do
so may alter device performance and reliability.
5. Avoid storage of the product in the presence of dust
or corrosive agents or gases.
Long-term storage should be avoided. Deterioration
of lead solderability may occur. It is advised that the
solderability of the device leads be re-inspected after
an extended period of storage, over one year.
Soldering Recommendations
1. The soldering iron tip temperature is not to exceed
370C. Failure to do so may alter device performance
and reliability.
2. Flow soldering method is not recommended. Solder
dipping can cause damage to the glass and harm the
imaging capability of the device. Recommended
method is by partial heating. Kodak recommends the
use of a grounded 30W soldering iron. Heat each pin
for less than 2 seconds duration.
Eastman Kodak Company, 2006
www.kodak.com/go/imagers
Revision 2.0 MTD/PS-0609 p38
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