參數(shù)資料
型號： K9F2808Q0C
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
元件分類： 圓形連接器
英文描述： Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:46; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
中文描述： 1,600 × 8位，8米× 16位NAND閃存
文件頁數(shù)： 2/33頁
文件大?。?/td> 583K
代理商： K9F2808Q0C
K9F2816U0C-DCB0,DIB0
FLASH MEMORY
2
K9F2808U0C-DCB0,DIB0
K9F2808U0C-YCB0,YIB0
K9F2816U0C-YCB0,YIB0
K9F2808U0C-VCB0,VIB0
GENERAL DESCRIPTION
Offered in 16Mx8bit or 8Mx16bit, the K9F28XXX0C is 128M bit with spare 4M bit capacity. The device is offered in 1.8V or 3.3V Vcc.
Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be per-
formed in typical 200
μ
s on the 528-byte(X8 device) or 264-word(X16 device) page and an erase operation can be performed in typ-
ical 2ms on a 16K-byte(X8 device) or 8K-word(X16 device) block. Data in the page can be read out at 50ns cycle time per word. The
I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all pro-
gram and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-
intensive systems can take advantage of the K9F28XXX0C’s extended reliability of 100K program/erase cycles by providing
ECC(Error Correcting Code) with real time mapping-out algorithm.
The K9F28XXX0C is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable
applications requiring non-volatility.
FEATURES
Voltage Supply
- 1.8V device(K9F28XXQ0C) : 1.7~1.95V
- 3.3V device(K9F28XXU0C) : 2.7 ~ 3.6 V
Organization
- Memory Cell Array
- X8 device(K9F2808X0C) : (16M + 512K)bit x 8bit
- X16 device(K9F2816X0C) : (8M + 256K)bit x 16bit
- Data Register
- X8 device(K9F2808X0C) : (512 + 16)bit x 8bit
- X16 device(K9F2816X0C) : (256 + 8)bit x16bit
Automatic Program and Erase
- Page Program
- X8 device(K9F2808X0C) : (512 + 16)Byte
- X16 device(K9F2816X0C) : (256 + 8)Word
- Block Erase :
- X8 device(K9F2808X0C) : (16K + 512)Byte
- X16 device(K9F2816X0C) : ( 8K + 256)Word
Page Read Operation
- Page Size
- X8 device(K9F2808X0C) : (512 + 16)Byte
- X16 device(K9F2816X0C) : (256 + 8)Word
- Random Access : 10
μ
s(Max.)
- Serial Page Access : 50ns(Min.)
16M x 8 Bit / 8M x 16 Bit NAND Flash Memory
Fast Write Cycle Time
- Program time : 200
μ
s(Typ.)
- Block Erase Time : 2ms(Typ.)
Command/Address/Data Multiplexed I/O Port
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
Command Register Operation
Unique ID for Copyright Protection
Package
- K9F28XXU0C-YCB0/YIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9F28XXU0C-PCB0/PIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - Pb-free Package
- K9F28XXX0C-DCB0/DIB0
63 - Ball TBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm)
- K9F28XXX0C-HCB0/HIB0
63 - Ball TBGA ( 9 x 11 /0.8mm pitch , Width 1.0 mm)
- Pb-free Package
- K9F2808U0C-VCB0/VIB0
48 - Pin WSOP I (12X17X0.7mm)
- K9F2808U0C-FCB0/FIB0
48 - Pin WSOP I (12X17X0.7mm) - Pb-free Package
* K9F2808U0C-V/F(WSOPI ) is the same device as
K9F2808U0C-Y/P(TSOP1) except package type.
PRODUCT LIST
Part Number
Vcc Range
Organization
PKG Type
K9F2808Q0C-D,H
1.7 ~ 1.95V
X8
TBGA
K9F2816Q0C-D,H
X16
K9F2808U0C-Y,P
2.7 ~ 3.6V
X8
TSOP1
K9F2808U0C-D,H
TBGA
K9F2808U0C-V,F
WSOP1
K9F2816U0C-Y,P
X16
TSOP1
K9F2816U0C-D,H
TBGA
相關(guān)PDF資料
PDF描述
K9F2816Q0C-HCB0 DB50 MALE/ DB50 MALE 2FT
K9F2816Q0C-HIB0 INTERNAL SNGL-DRV LOOP CABLE C
K9F2816U0C-PIB0 16M x 8 Bit NAND Flash Memory
K9F2816U0C-HCB0 16M x 8 Bit NAND Flash Memory
K9F3208W0A- Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; Number of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K9F2808Q0C-DCB0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M x 8 Bit , 8M x 16 Bit NAND Flash Memory
K9F2808Q0C-HCB0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M x 8 Bit NAND Flash Memory
K9F2808Q0C-HIB0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M x 8 Bit NAND Flash Memory
K9F2808U0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M x 8 Bit NAND Flash Memory
K9F2808U0A 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M x 8 Bit NAND Flash Memory
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