參數(shù)資料
型號: K9F2808Q0C-HCB0
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 16M x 8 Bit NAND Flash Memory
中文描述: 1,600 × 8位NAND閃存
文件頁數(shù): 11/31頁
文件大?。?/td> 774K
代理商: K9F2808Q0C-HCB0
FLASH MEMORY
11
K9F2808U0C
AC Timing Characteristics for Command / Address / Data Input
NOTE
: 1. If tCS is set less than 10ns, tWP must be minimum 35ns, otherwise, tWP may be minimum 25ns.
Parameter
Symbol
K9F2808U0C
Unit
CLE Set-up Time
t
CLS
0
-
ns
CLE Hold Time
t
CLH
10
-
ns
CE Setup Time
t
CS
0
-
ns
CE Hold Time
t
CH
10
-
ns
WE Pulse Width
t
WP
25
-
ns
ALE Setup Time
t
ALS
0
-
ns
ALE Hold Time
t
ALH
10
-
ns
Data Setup Time
t
DS
20
-
ns
Data Hold Time
t
DH
10
-
ns
Write Cycle Time
t
WC
50
-
ns
WE High Hold Time
t
WH
15
-
ns
AC Characteristics for Operation
NOTE
: 1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5us.
2. To break the sequential read cycle, CE must be held high for longer time than tCEH.
3. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
Parameter
Symbol
K9F2808U0C
Unit
Data Transfer from Cell to Register
t
R
-
10
μ
s
ALE to RE Delay
t
AR
10
-
ns
CLE to RE Delay
t
CLR
10
-
ns
Ready to RE Low
t
RR
20
-
ns
RE Pulse Width
t
RP
25
-
ns
WE High to Busy
t
WB
-
100
ns
Read Cycle Time
t
RC
50
-
ns
CE Access Time
t
CEA
-
45
ns
RE Access Time
t
REA
-
30
ns
RE High to Output Hi-Z
t
RHZ
-
30
ns
CE High to Output Hi-Z
t
CHZ
-
20
ns
RE or CE High to Output hold
t
OH
15
-
ns
RE High Hold Time
t
REH
15
-
ns
Output Hi-Z to RE Low
t
IR
0
-
ns
WE High to RE Low
t
WHR
60
-
ns
Device Resetting Time
(Read/Program/Erase)
t
RST
-
5/10/500
(1)
μ
s
K9F2808U0C-
Y,P,V,F only
Last RE High to Busy
(at sequential read)
t
RB
-
100
ns
CE High to Ready(in case of interception by
CE at read)
t
CRY
-
50 +tr(R/B)
(3)
ns
CE High Hold Time(at the last serial read)
(2)
t
CEH
100
-
ns
相關(guān)PDF資料
PDF描述
K9F2808U0C-F 16M x 8 Bit NAND Flash Memory
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K9F2808Q0C-HIB0 16M x 8 Bit NAND Flash Memory
K9F2808U0C-HCB0 16M x 8 Bit NAND Flash Memory
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