參數(shù)資料
型號: K6R1016V1D
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
中文描述: 64Kx16位高速CMOS靜態(tài)RAM(3.3V的)在商業(yè)和工業(yè)溫度范圍操作。
文件頁數(shù): 9/11頁
文件大?。?/td> 259K
代理商: K6R1016V1D
K6R1016V1D
CMOS SRAM
Revision 3.0
June 2002
- 9 -
for AT&T
FUNCTIONAL DESCRIPTION
* X means Don
t Care
.
CS
WE
OE
LB
UB
Mode
I/O Pin
Supply Current
I/O
1
~I/O
8
I/O
9
~I/O
16
H
X
X*
X
X
Not Select
High-Z
High-Z
I
SB
, I
SB1
L
H
H
X
X
Output Disable
High-Z
High-Z
I
CC
L
X
X
H
H
L
H
L
L
H
Read
D
OUT
High-Z
I
CC
H
L
High-Z
D
OUT
L
L
D
OUT
D
OUT
L
L
X
L
H
Write
D
IN
High-Z
I
CC
H
L
High-Z
D
IN
L
L
D
IN
D
IN
NOTES
(WRITE CYCLE)
1. All write cycle timing is referenced from the last valid address to the first transition address.
2. A write occurs during the overlap of a low CS, WE, LB and UB. A write begins at the latest transition CS going low and WE
going low; A write ends at the earliest transition CS going high or WE going high. t
WP
is measured from the beginning of write
to the end of write.
3. t
CW
is measured from the later of CS going low to end of write.
4. t
AS
is measured from the address valid to the beginning of write.
5. t
WR
is measured from the end of write to the address change. t
WR
applied in case a write ends as CS or WE going high.
6. If OE, CS and WE are in the Read Mode during this period, the I/O pins are in the output low-Z state. Inputs of opposite phase
of the output must not be applied because bus contention can occur.
7. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycle.
8. If CS goes low simultaneously with WE going or after WE going low, the outputs remain high impedance state.
9. Dout is the read data of the new address.
10. When CS is low: I/O pins are in the output state. The input signals in the opposite phase leading to the output should not be
applied.
Address
CS
Valid Data
UB, LB
WE
Data in
Data out
TIMING WAVEFORM OF WRITE CYCLE(4)
(UB, LB Controlled)
t
WC
t
CW(3)
t
BW
t
WP(2)
t
DH
t
DW
t
WR(5)
t
AW
t
AS(4)
High-Z
High-Z(8)
t
BLZ
t
WHZ(6)
High-Z
相關(guān)PDF資料
PDF描述
K6R1016V1C-C10 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1C-C12 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1C-C15 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1C-C20 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1C-I10 64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K6R1016V1D-EC08 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1D-EC08/10 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1D-EC10 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1D-EI08 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.
K6R1016V1D-EI08/10 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating) Operated at Commercial and Industrial Temperature Ranges.