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參數(shù)資料
| 型號： | ISP1109 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal Serial Bus transceiver with carkit support |
| 中文描述： | 與車載通用串行總線收發(fā)器支持 |
| 文件頁數(shù)： | 52/59頁 |
| 文件大?。?/td> | 295K |
| 代理商： | ISP1109 |
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9397 750 13355
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 14 July 2005
52 of 59
Philips Semiconductors
ISP1109
USB transceiver with carkit support
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
20. Abbreviations
21. References
[1]
[2]
[3]
[4]
Universal Serial Bus Specification Rev. 2.0
CEA
936
A, Mini-USB Analog Carkit Interface
The I
2
C-bus Specification; Version 2.1
ECN_27%_ Resistor (http://www.usb.org/developers/docs).
Table 64:
Acronym
ATX
DC
ESD
I
2
C-bus
LSB
MIC
MSB
OTG
POR
PORP
RxD
SE1
SoC
SPI
SRP
TxD
UART
USB
Abbreviations
Description
Analog USB transceiver
Direct Current
Electro-Static Discharge
Inter IC-bus
Least Significant Bit
Microphone
Most Significant Bit
On-The-Go
Power-On Reset
Power-On Reset Pulse
Receive Data
Single-Ended One
System-on-a-Chip
Serial Parallel Interface
Session Request Protocol
Transmit Data
Universal Asynchronous Receiver-Transmitter
Universal Serial Bus
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1109BS | Universal Serial Bus transceiver with carkit support |
| ISP1122A | Universal Serial Bus stand-alone hub |
| ISP1122ABD | Universal Serial Bus stand-alone hub |
| ISP1122AD | Universal Serial Bus stand-alone hub |
| ISP1122ANB | Universal Serial Bus stand-alone hub |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1109BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver with carkit support |
| ISP1109BS,118 | 功能描述:射頻收發(fā)器 USB FS TRANSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BS,151 | 功能描述:射頻收發(fā)器 DO NOT USE ORDER -T PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BS,157 | 功能描述:射頻收發(fā)器 DO NOT USE ORDER -T PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BSFE | 功能描述:IC TXRX SERIAL BUS UNIV 32HVQFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:驅(qū)動器 驅(qū)動器/接收器數(shù):4/0 規(guī)程:RS422 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC N 包裝:帶卷 (TR) |
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