- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄8545 > ISL5961IAZ (Intersil)CONV D/A 14-BIT 3.3V 28-TSSOP PDF資料下載
參數(shù)資料
| 型號： | ISL5961IAZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | CONV D/A 14-BIT 3.3V 28-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 位數(shù)： | 14 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 120mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-TSSOP |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 150M |
3-13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL5961
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1-207825-4 | CONN RCPT CPC 4POS STD SER 1 PCB |
| ISL5861/2IAZ | CONV D/A 12-BIT HS 28-TSSOP |
| LT1190CS8#PBF | IC OP-AMP VIDEO HISPD SNGL 8SOIC |
| LT1190CS8 | IC OP-AMP VIDEO HISPD SNGL 8SOIC |
| HI5860IBZ-T | CONV D/A 12BIT 130MSPS 28-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL5961IB | 功能描述:IC DAC 14BIT 130MSPS 3.3V 28SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| ISL5961IBZ | 功能描述:CONV D/A 14-BIT 3.3V 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| ISL59830 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:True Single Supply Video Driver |
| ISL59830_06 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:True Single Supply Video Driver |
| ISL59830A | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:True Single Supply Video Driver With Power Down |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。