1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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FN4654.7
HI5860
12-Bit, 130MSPS, High Speed D/A
Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices.
Pinout
HI5860
(28 LD SOIC, TSSOP)
TOP VIEW
Features
Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 130MSPS
Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB
Adjustable Full Scale Output Current . . . . . 2mA to 20mA
Internal 1.2V Bandgap Voltage Reference
Single Power Supply from +5V to +3V
Power-Down Mode
CMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(76dBc, fS = 50MSPS, fOUT = 2.51MHz)
Excellent Multitone Intermodulation Distortion
Pb-Free Available (RoHS Compliant)
Applications
Basestations (Cellular, WLL)
Medical/Test Instrumentation
Wireless Communications Systems
Direct Digital Frequency Synthesis
Signal Reconstruction
High Resolution Imaging Systems
Arbitrary Waveform Generators
28
27
26
25
24
23
22
21
20
19
18
17
16
15
(MSB) D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
(LSB) D0
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
ACOM
AVDD
COMP2
IOUTB
COMP1
FSADJ
REFIO
REFLO
SLEEP
DVDD
IOUTA
ACOM
Ordering Information
PART
NUMBER
PART MARKING
TEMP. RANGE (°C)
PACKAGE
PKG. DWG. #
CLOCK SPEED
HI5860IA*
HI5860 IA
-40 to +85
28 Ld TSSOP
M28.173
130MHz
HI5860IB
-40 to +85
28 Ld SOIC
M28.3
130MHz
HI5860IBZ*
(Note)
HI5860IBZ
-40 to +85
28 Ld SOIC (Pb-free)
M28.3
130MHz
HI5860SOICEVAL1
+25
Evaluation Platform
130MHz
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
Data Sheet
February 6, 2008