16
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6627.4
June 10, 2010
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com:
ISL54209Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
3/8/10
FN6627.4
Made correction to Tjc in Thermal information and corresponding notes as follows: 2.1x1.6
uTQFN package from “48.3” to “100” and 1.8x1.4 uTQFN package from “61.9” to “105”. Added
note that is "not direct attach" for both uTQFN packages.
Added Latchup to Abs Max Ratings.
Updated POD L10.2.1X1.6A to most recent rev. Changes were to convert to new format by
moving dimensions from table onto drawing (no dimension changes)
Updated POD L10.3X3A to most recent rev. Changes were to convert to new format by moving
dimensions from table onto drawing (no dimension changes)
11/24/09
FN6627.3
Added 10 Ld 1.8x1.4 TQFN option
Added MSL note to Ordering Information
Added “Boldface limits apply...” to common conditions of Electrical Specifications table. Bolded
full temperature specs in spec table.
Added Revision History and Products section
Added L10.1.8x1.4A package outline drawing
Under thermal information for the 2.1 x 1.6 TQFN & the 1.8 x 1.4 TQFN, added new boiler
plate note for theta JC indicating measurement taken at center of top of package. Moved
Note 8 down to 3x3 TDFN.
7/1/08
FN6627.2
Added eval part # to ordering info and updated ESD HBM rating.
Applied Intersil standards: Updated pb-free Note 2 to match format, updated over-temp note
4/3/08
FN6627.1
-P2, added Note 3 to order info per Mark Kwoka's new verbiage based on lead finish. Update
cross refs accordingly
-P3, changed ESD and added apps info for the VBUS control
-P5, Note 10 revised to: "Parts are 100% tested at +25°C. Temperature limits established by
characterization and are not production tested." from "Parts are 100% tested at +25°C. Over-
temperature limits established by characterization and are not production tested."
12/20/07
FN6627.0
Initial Release
ISL54209