參數(shù)資料
型號: ISL12022MIBZR5421
廠商: INTERSIL CORP
元件分類: 時(shí)鐘/數(shù)據(jù)恢復(fù)及定時(shí)提取
英文描述: REAL TIME CLOCK, PDSO20
封裝: ROHS COMPLIANT, PLASTIC, MS-013AC, SOIC-20
文件頁數(shù): 25/29頁
文件大?。?/td> 395K
代理商: ISL12022MIBZR5421
ISL12022MR5421
5
FN7576.1
June 4, 2010
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT and IRQ/FOUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . . -0.3V to VDD +0.3V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . >300V
Charge Discharge Model . . . . . . . . . . . . . . . . . . . >2200V
Latch-up . . . . . . . . . . . . . . . . . . . . . . . . Class II Level A,
passed at +85°C ambient with the Level A latch-up
criteria of 100mA or 1.5*VMAX input
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
20 Lead SOIC (Notes 3, 4) . . . . . . 70
35
Storage Temperature. . . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note 5). . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
4. For θJC, the “case temp” location is on top of the package and measured in the center of the package between Pins 6 and 15.
5. The ISL12022MR5421 Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend
on the reflow temperature and length of exposure. A general rule is to use only one reflow cycle and keep the temperature
and time as short as possible. Changes on the order of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise
stated. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 6)
TYP
(Note 7)
MAX
(Note 6) UNITS NOTES
VDD
Main Power Supply
(Note 14)
2.7
5.5
V
VBAT
Battery Supply Voltage
(Note 14)
1.8
5.5
IDD1
Supply Current. (I2CNot Active,
Temperature Conversion Not
Active, FOUT Not Active)
VDD = 5V
4.1
7
A
VDD = 3V
3.5
6
A
IDD2
Supply Current. (I2C Active,
Temperature Conversion Not
Active, Fout Not Active)
VDD = 5V
200
500
A
IDD3
Supply Current. (I2CNot Active,
Temperature Conversion Active,
FOUT Not Active)
VDD = 5V
120
400
A
IBAT
Battery Supply Current
VDD = 0V, VBAT = 3V,
TA =+25°C
1.0
1.6
A
VDD = 0V, VBAT = 3V
1.0
5.0
A
IBATLKG Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
ILI
Input Leakage Current on SCL
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
A
ILO
I/O Leakage Current on SDA
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
A
VBATM
Battery Level Monitor Threshold
-100
+100
mV
VPBM
Brownout Level Monitor Threshold
-100
+100
mV
VTRIP
VBAT Mode Threshold
(Note 14)
2.0
2.2
2.4
V
VTRIPHYS VTRIP Hysteresis
30
mV
VBATHYS VBAT Hysteresis
50
mV
ΔFoutT Oscillator Stability vs Temperature VDD = 3.3V
-5
+5
ppm
ΔFoutV Oscillator Stability vs Voltage
2.7V ≤ VDD ≤ 5.5V
-3
+3
ppm
ISL12022MR5421
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