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參數(shù)資料
| 型號(hào)： | ISD1750SYR |
| 廠商： | Nuvoton Technology Corporation of America |
| 文件頁數(shù)： | 15/24頁 |
| 文件大小： | 0K |
| 描述： | IC VOICE REC/PLAY 50SEC 28-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | ISD1700, ChipCorder® |
| 接口： | SPI |
| 持續(xù)時(shí)間： | 50 秒 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-SOIC |
| 配用： | ISD-COB1790-ND - BOARD DEMO FOR ISD1790 ISD-COB1760-ND - BOARD DEMO FOR ISD1760 ISD-COB1750-ND - BOARD DEMO FOR ISD1750 ISD-COB1740-ND - BOARD DEMO FOR ISD1740 ISD-COB1730-ND - BOARD DEMO FOR ISD1730 ISD-COB17240-ND - BOARD DEMO FOR ISD17240 ISD-COB17210-ND - BOARD DEMO FOR ISD17210 ISD-COB17150-ND - BOARD DEMO FOR ISD17150 ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES |
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 22 -
Revision 1.31
12
11
ORDERING INFORMATION
Product Number Descriptor Key
I17xxxxxxx
Product Series:
17 = 1700
Package Type:
X = Die
E = Thin Small Outline Package (TSOP)
S = Small Outline Integrated Circuit
(SOIC) Package
P = Plastic Dual Inline Package (PDIP)
Temperature:
I
= Industrial (-40
°C to +85°C)
Blank = Commercial
Die (0°C to +50°C)
Package (0°C to +70°C)
Duration:
30
:
20 – 60 secs
40
:
26 – 80 secs
50
:
33 – 100 secs
60
:
40 – 120 secs
90
:
60 – 180 secs
120 :
80 – 240 secs
150 :
100 – 300 secs
180 :
120 – 360 secs
210 :
140 – 420 secs
240 :
160 – 480 secs
Product Name:
I = ISD
Tape & Reel:
Blank = None
R
= Tape & Reel
Lead-Free:
Y
= Lead-Free
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Nuvoton
Sales Representatives for any questions and the availability.
For the latest product information, please contact the Nuvoton Sales/Rep or
access Nuvoton’s worldwide web site at
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| ISD1750SYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XY | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XY01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XYI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1750XYI01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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