Publication Release Date: Nov 6, 2008 - 19 - Revision 1.31 11 10 PACKAGING 11.1 21 28" />
    
    
    
    
    
    
    
    
    	
    
        
 
型號: 
ISD1750SYR 
 
廠商: 
Nuvoton Technology Corporation of America 
 
文件頁數(shù): 
11/24頁 
 
文件大小: 
0K 
 
描述: 
IC VOICE REC/PLAY 50SEC 28-SOIC 
 
標準包裝: 
1,000 
 
系列: 
ISD1700, ChipCorder® 
 
接口: 
SPI 
 
持續(xù)時間: 
50 秒 
 
安裝類型: 
表面貼裝 
 
封裝/外殼: 
28-SOIC(0.295",7.50mm 寬) 
 
供應(yīng)商設(shè)備封裝: 
28-SOIC 
 
配用: 
ISD-COB1790-ND - BOARD DEMO FOR ISD1790 
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
 
 
ISD5008EYI 
IC VOICE REC/PLAY 4-8MIN 28-TSOP 
 
ISL12008IB8Z 
IC RTC I2C LO-POWER 8-SOIC 
 
ISL12020MIRZ-T7A 
IC RTC/CALENDAR TEMP SNSR 20DFN 
 
ISL12022IBZ-T7A 
IC RTC/CALENDAR TEMP SNSR 8SOIC 
 
ISL12022MAIBZ 
IC RTC/CALENDAR TEMP SNSR 20SOIC 
 
 
 
ISD1750SYR01 
 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices 
 
ISD1750XY 
 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices 
 
ISD1750XY01 
 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices 
 
ISD1750XYI 
 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices 
 
ISD1750XYI01 
 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices