參數(shù)資料
型號(hào): IRLL110PBF
廠商: International Rectifier
英文描述: HEXFET㈢ Power MOSFET
中文描述: ㈢的HEXFET功率MOSFET
文件頁(yè)數(shù): 1/8頁(yè)
文件大小: 212K
代理商: IRLL110PBF
Parameter
Max.
1.5
0.93
12
3.1
2..0
0.025
0.017
-/+10
50
1.5
0.31
5.5
-55 to + 150
300 (1.6mm from case)
Units
I
D
@ Tc = 25°C
I
D
@ Tc = 100°C
I
DM
P
D
@Tc = 25°C
P
D
@T
A
= 25°C
Continuous Drain Current, V
GS
@ 5.0 V
Continuous Drain Current, V
GS
@ 5.0 V
Pulsed Drain Current
Power Dissipation
Power Dissipation (PCB Mount)**
Linear Derating Factor
Linear Derating Factor (PCB Mount)**
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Soldewring Temperature, for 10 seconds
W
W/°C
V
mJ
A
mJ
V/ns
°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J,
T
STG
IRLL110PbF
HEXFET
Power MOSFET
Surface Mount
Available in Tape & Reel
Dynamic dv/dt Rating
Repetitive Avalanche Rated
Logic-Level Gate Drive
RDS(on)Specified at VGS= 4V & 5V
Fast Switching
Lead-Free
PD - 95222
S
D
G
V
DSS
= 100V
R
DS(on)
= 0.54
I
D
= 1.5A
Third Generation HEXFETs from International Rectifier
provide the designer with the best combination of fast
switching, ruggedized device design, low on-resistance
and cost-effectiveness.
The SOT-223 package is designed for surface-mount using
vapor phase, infra red, or wave soldering techniques. Its
unique package design allows for easy automatic pick-and-
place as with other SOT or SOIC packages but has the
added advantage of improved thermal performance due to
an enlarged tab for heatsinking. Power dissipation of
grreater than 1.25W is possible in a typical surface mount
application.
Absolute Maximum Ratings
04/27/04
Description
SOT-223
** When mounted on 1'' square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
www.irf.com
Parameter
Typ.
–––
–––
Max.
40
60
Units
R
θ
JC
R
θ
JA
Junction-to-PCB
Junction-to-Ambient. (PCB Mount)**
Thermal Resistance
°C/W
A
1
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