參數(shù)資料
型號: IRFZ24VSPBF
廠商: International Rectifier
英文描述: HEXFET Power MOSFET
中文描述: HEXFET功率MOSFET
文件頁數(shù): 1/10頁
文件大?。?/td> 278K
代理商: IRFZ24VSPBF
IRFZ24VSPbF
IRFZ24VLPbF
HEXFET
Power MOSFET
V
DSS
= 60V
R
DS(on)
= 60m
I
D
= 17A
S
D
G
Advanced HEXFET
Power MOSFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs are well known
for, provides the designer with an extremely efficient and reliable device for
use in a wide variety of applications.
The D
2
Pak is a surface mount power package capable of accommodating
die sizes up to HEX-4. It provides the highest power capability and the
lowest possible on-resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRFZ24VL) is available for low-profile applications.
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C
= 100°C
Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current
P
D
@T
C
= 25°C
Power Dissipation
Linear Derating Factor
V
GS
Gate-to-Source Voltage
I
AR
Avalanche Current
E
AR
Repetitive Avalanche Energy
dv/dt
Peak Diode Recovery dv/dt
T
J
Operating Junction and
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Optimized for SMPS Applications
Lead-Free
Description
Max.
17
12
68
44
0.29
± 20
17
4.4
4.2
Units
A
W
W/°C
V
A
mJ
V/ns
-55 to + 175
300 (1.6mm from case )
°C
D
2
Pak
IRFZ24VS
TO-262
IRFZ24VL
www.irf.com
1
Parameter
Typ.
–––
–––
Max.
3.4
40
Units
R
θ
JC
R
θ
JA
Junction-to-Case
Junction-to-Ambient (PCB Mounted)**
Thermal Resistance
°C/W
PD - 95524
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