參數(shù)資料
型號: IRF7306
廠商: International Rectifier
英文描述: HEXFET Power MOSFET
中文描述: HEXFET功率MOSFET
文件頁數(shù): 1/9頁
文件大小: 113K
代理商: IRF7306
HEXFET
Power MOSFET
PD - 9.1241C
IRF7306
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Generation V Technology
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Ultra Low On-Resistance
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Dual P-Channel Mosfet
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Surface Mount
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Available in Tape & Reel
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Dynamic dv/dt Rating
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Fast Switching
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Power dissipation of greater than 0.8W is possible in
a typical PCB mount application.
SO-8
V
DSS
= -30V
R
DS(on)
= 0.10
Parameter
Max.
-4.0
-3.6
-2.9
-14
2.0
0.016
±20
-5.0
Units
I
D
@ T
A
= 25°C
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
10 Sec. Pulsed Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
W
W/°C
V
V/ns
°C
V
GS
dv/dt
T
J,
T
STG
-55 to + 150
Absolute Maximum Ratings
A
D1
D1
D2
D2
G1
S2
G2
S1
Top View
8
1
2
3
4
5
6
7
8/25/97
Thermal Resistance Ratings
Parameter
Maximum Junction-to-Ambient
Typ.
–––
Max.
62.5
Units
R
θ
JA
°C/W
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