參數(shù)資料
型號: IR3500MTRPBF
廠商: International Rectifier
英文描述: XPHASE3TM VR11.0 & AMD PVID CONTROL IC
中文描述: XPHASE3TM VR11.0
文件頁數(shù): 45/47頁
文件大?。?/td> 778K
代理商: IR3500MTRPBF
IR3500
Page 45 of 47
June 12, 2007
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of
0.17mm remains.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
Ensure that the solder resist in-between the lead lands and the pad land is
0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
The single via in the land pad should be tented or plugged from bottom board side with solder resist.
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