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| 型號： | INTRO_TO_TRANSISTOR |
| 文件頁數(shù)： | 10/13頁 |
| 文件大?。?/td> | 404K |
| 代理商： | INTRO_TO_TRANSISTOR |
7.
Notes Regarding Storage, Characteristic Tests, and Handling
Since reliability can be affected adversely by improper storage
environment and handling methods during Characteristic tests,
please observe the following cautions.
a) Cautions for Storage
1. Ensure that storage conditions comply with the standard
temperature (5 to 35°C) and the standard relative humidity
(arround 40 to 75%) and avoid storage locations that
experience extreme changes in temperature or humidity.
2. Avod locations where dust or harmful gases are present,
and avoid direct sunlight.
3. Reinspect for rust in leads and solderbility that have been
stored for a long time.
b) Cautions for Characteristic Tests and Handling
1. When characteristic tests are carried out during inspection
testing and other standard test periods, protect the transistor
from surges of power from the testing device, shorts between
the transistor and the heatsink
c) Silicone Grease
When using a heatsink, please coat the back surface of the
transistor and both surfaces of the insulating plate with a thin
layer of silicone grease to improve heat transfer between the
transistor and the heatsink.
Recommended Silicone Grease
G-746 (Shin-Etsu Chemical)
YG6260 (Toshiba Silicone)
SC102 (Dow Corning Toray Silicone)
d) Torque when Tightening Screws
Thermal resistance increases when tightening torque is small,
and radiation effects are decreased. When the torque is too
high, the screw can cut, the heatsink can be deformed, and/or
distortion can arise in the product’s frame. To avoid these
problems, Table 2 shows the recommended tightening torques
for each product type.
Table 2. Screw Tightening Torques
Package
Screw Tightening Torque
MT25 (TO-220)
0.490 to 0.686 N·m (5 to 7kgf·cm)
FM20 (TO-220 Full Mold)
0.490 to 0.686 N·m (5 to 7kgf·cm)
MT100 (TO-3P)
0.686 to 0.822 N·m (7 to 9kgf·cm)
FM100 (TO-3P Full Mold)
0.686 to 0.822 N·m (7 to 9kgf·cm)
MT200 (TO-3P two-point mount)
0.686 to 0.822 N·m (7 to 9kgf·cm)
e) Soldering Temperature
In general, the transistor is subjected to high temperatures when
it is mounted on the printed circuit board, whether from flow solder
from a solderbath, or, in hand operations from a soldering iron.
The testing method and test conditions (JIS-C-7021 standards)
for a transistor’s heat resistance during soldering are:
At a distance of 1.5mm from the transistor’s main body,
apply 260°C for 10 seconds, and 350°C for 3 seconds.
However, please stay well within these limits and for as short
a time as possible during actual soldering.
8
Reliability
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