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參數(shù)資料
| 型號： | IDT79RC64V474-180DZ |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 22/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 64BIT EMB 180MHZ 128-QFP |
| 標準包裝： | 24 |
| 處理器類型： | RISC 64-位 |
| 速度： | 180MHz |
| 電壓： | 3.3V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 128-BQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 128-PQFP（28x28） |
| 包裝： | 托盤 |
| 其它名稱： | 79RC64V474-180DZ |
6 of 25
April 10, 2001
RC64474 RC64475
Power Management
Executing the WAIT instruction enables the processor to enter
Standby mode. The internal clocks will shut down, thus freezing the
pipeline. The PLL, internal timer, and some of the input pins (Int[5:0]*,
NMI*, ExtReq*, Reset*, and ColdReset*) will continue to run. Once the
CPU is in Standby Mode, any interrupt, including the internally gener-
ated timer interrupt, will cause the CPU to exit Standby Mode.
Thermal Considerations
The RC64474/475 come in a QFP with a drop-in heat spreader and
are guaranteed in a case temperature range of 0
° to +85° C, for
commercial temperature devices; - 40
° to +85° for industrial tempera-
ture devices. The type of package, speed (power) of the device, and
airflow conditions affect the equivalent ambient temperature conditions
that will meet this specification.
The equivalent allowable ambient temperature, TA, can be calculated
using the thermal resistance from case to ambient (
CA) of the given
package. The following equation relates ambient and case tempera-
tures:
TA = TC - P *
CA
where P is the maximum power consumption at hot temperature,
calculated by using the maximum ICC specification for the device.
Typical values for
CA at various airflows are shown in Table 4. Note
that the RC64474/475 processors implement advanced power manage-
ment, which substantially reduces the typical power dissipation of the
device.
Data Sheet Revision History
December 1998: Changed ordering code on 128-pin package from
DQ / DQI (Industrial) to DZ / DZI (Industrial).
January 1999: Removed 5V tolerance capability and deleted 5V
tolerant pin.
February 1999: Changed the package drawings to reflect the new
208-pin DP (DPI) and 128-pin DZ (DZI) packages.
May 1999: Removed “Preliminary” status from data sheet.
Changes in DC Electrical Characteristics table. Changes in Pin
Description table. Changes in Clock Parameters table. Changes in
System Interface Parameters table.
September 1999: Updated Revision History section.
CA
Airflow (ft/min)
0
200 400 600 800 1000
128 QFP
16
10
9
7
6
5
208 QFP
20
13
10
9
8
7
Table 4 Thermal Resistance (
CA) at Various Airflows
January 17, 2000: Added “with DSP extensions” in the CPU row
under RC64574 and RC64575 columns in Table 1. Added “l(fā)ockable by
line” in the Caches row under RC64574 and RC64575 columns in Table
1. Revised Data Output and Data Output Hold rows in System Interface
Parameters table.
February 10, 2000: Revised values in Table 4, Thermal Resistance.
Old values were:
March 13, 2000: Replaced existing figure in Mode Configuration
Interface Reset Sequence section with 3 reset figures.
March 28, 2000: Removed the symbol tDZ from Figure 3.
April 17, 2000: Changed VIH value in 200MHz column from 2.0V to
0.7VCC.
April 10, 2001: In the Data Output and Data Output Hold categories
of the System Interface Parameters table, changed values in the Min
column for all speeds from 1.0 to 0. Deleted Output for Loading AC
Testing diagram and added Output Loading for AC Timing diagram
(Figure 8).
CA
Airflow (ft/min)
0
200 400 600 800 1000
128 QFP
20
12
9
8
7
6
208 QFP
20
12
9
8
7
6
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| IDT79RC64V474-200DZ | 功能描述:IC MPU 64BIT EMB 200MHZ 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| IDT79RC64V475-180DP | 功能描述:IC MPU 64BIT EMB 180MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| IDT79RC64V475-200DP | 功能描述:IC MPU 64BIT EMB 200MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| IDT79RV4640-133DU | 功能描述:IC SGL BOARD COMPUTER 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| IDT79RV4640-133DUG | 功能描述:IC SGL BOARD COMPUTER 128-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
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