SUPERSYNC FIFOTM
參數(shù)資料
型號(hào): IDT72V2111L15PFI8
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 19/27頁(yè)
文件大?。?/td> 0K
描述: IC FIFO SS 512X9 15NS 64QFP
標(biāo)準(zhǔn)包裝: 750
系列: 72V
功能: 同步
存儲(chǔ)容量: 4.6K(512 x 9)
訪問(wèn)時(shí)間: 15ns
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-TQFP(14x14)
包裝: 帶卷 (TR)
其它名稱: 72V2111L15PFI8
26
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V2101/72V2111 3.3V HIGH DENSITY CMOS
SUPERSYNC FIFOTM 262,144 x 9, 524,288 x 9
Figure 20. Block Diagram of 524,288 x 9 and 1,048,576 x 9 Depth Expansion
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72V2101 can easily be adapted to applications requiring depths
greater than 262,144 and 524,288 for the IDT72V2111 with a 9-bit bus width.
In FWFT mode, the FIFOs can be connected in series (the data outputs of one
FIFOconnectedtothedatainputsofthenext)withnoexternallogicnecessary.
The resulting configuration provides a total depth equivalent to the sum of the
depthsassociatedwitheachsingleFIFO. Figure20 showsadepthexpansion
using two IDT72V2101/72V2111 devices.
CareshouldbetakentoselectFWFTmodeduringMasterResetforallFIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
datawordappearsattheoutputsofoneFIFO,thatdevice's
ORlinegoesLOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for
ORof
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK
period. NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenWCLKandtransferclock,orRCLKandtransfer
clock, for the
OR flag.
The"rippledown"delayisonlynoticeableforthefirstwordwrittentoanempty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configurationwill"bubbleup"fromthelastFIFOtothepreviousoneuntilitfinally
movesintothefirstFIFOofthechain. Eachtimeafreelocationiscreatedinone
FIFO of the chain, that FIFO's
IRlinegoesLOW,enablingtheprecedingFIFO
to write a word to fill it.
Forafullexpansionconfiguration,theamountoftimeittakesfor
IRofthefirst
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenRCLKandtransferclock,orWCLKandtransfer
clock, for the
IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
isfaster. Boththeseactionsresultindatamoving,asquicklyaspossible,tothe
end of the chain and free locations to the beginning of the chain.
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
IDT
72V2101
72V2111
TRANSFER CLOCK
4669 drw 23
n
FWFT/SI
IDT
72V2101
72V2111
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