24
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V2101/72V2111 3.3V HIGH DENSITY CMOS
SUPERSYNC FIFOTM 262,144 x 9, 524,288 x 9
NOTES:
1. n =
PAE offset.
2. For IDT Standard mode
3. For FWFT mode.
4. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that
PAE will go HIGH (after one RCLK cycle plus tPAE). If the time between the rising edge of
WCLK and the rising edge of RCLK is less than tSKEW2, then the
PAE deassertion may be delayed one extra RCLK cycle.
5.
PAE is asserted and updated on the rising edge of WCLK only.
Figure 18. Half-Full Flag Timing (IDT Standard and FWFT Modes)
Figure 17. Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
NOTES:
1. For IDT Standard mode: D = maximum FIFO depth. D = 262,144 for the IDT72V2101 and 524,288 for the IDT72V2111.
2. For FWFT mode: D = maximum FIFO depth. D = 262,145 for the IDT72V2101 and 524,289 for the IDT72V2111.
WCLK
t ENH
t CLKH
tCLKL
WEN
PAE
RCLK
t ENS
n words in FIFO (2),
n+1 words in FIFO (3)
tPAE
tSKEW2
tPAE
12
(4)
REN
4669 drw 20
t ENS
t ENH
n+1 words in FIFO (2),
n+2 words in FIFO (3)
n words in FIFO (2),
n+1 words in FIFO (3)
WCLK
tENS
tENH
WEN
HF
tENS
tHF
RCLK
tHF
REN
4669 drw 21
tCLKL
tCLKH
D/2 words in FIFO(1),
[
+ 1
] words in FIFO(2)
D-1
2
D/2 + 1 words in FIFO
(1),
[
+ 2
] words in FIFO(2)
D-1
2
D/2 words in FIFO(1),
[
+ 1
] words in FIFO(2)
D-1
2