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參數(shù)資料
| 型號： | IDT70V7319S166BC |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | DRAM |
| 英文描述： | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
| 中文描述： | 256K X 18 DUAL-PORT SRAM, 12 ns, PBGA256 |
| 封裝： | BGA-256 |
| 文件頁數(shù)： | 22/22頁 |
| 文件大?。?/td> | 621K |
| 代理商： | IDT70V7319S166BC |
6.42
22
IDT70V7319S
High-Speed 256K x 18 Synchronous Bank-Switchable Dual-Port Static RAM Industrial and Commercial Temperature Ranges
Ordering Information
A
Power
999
Speed
A
Package
A
Process/
Temperature
Range
Blank
I
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
BF
DD
BC
208-pin fpBGA (BF-208)
144-pin TQFP (DD-144)
256-pin BGA (BC-256)
200
166
133
XXXXX
Device
Type
IDT
Speed in Megahertz
5629 drw 22
S
Standard Power
70V7319 4Mbit (256K x 18-Bit) Synchronous Bank-Switchable Dual-Port RAM
Commercial Only
(1)
Commercial & Industrial
(2)
Commercial & Industrial
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
for SALES:
800-345-7015 or 408-727-5166
fax: 408-492-8674
www.idt.com
for Tech Support:
831-754-4613
DualPortHelp@idt.com
Datasheet Document History:
1/5/00:
6/20/01:
Initial Public Offering
Page 1 Added JTAG information for TQFP package
Page 4 & 22 Changed TQFP package fromDA to DD
Corrected Pin number on TQFP package from100 to 110
Page 20 Increased t
JCD
from20ns to 25ns
Page 4 Changed body size for DD package from22mmx 22mmx1.6mmto 20mmx 20mmx 1.4mm
Page 9 Changed I
SB
3
values for commercial and industrial DC Electrical Characteristics
Page 2, 3 & 4 Added date revision for pin configurations
Page 11 Changed t
OE
value in AC Electrical Characteristics, please refer to Errata #SMEN-01-05
Page 1 & 22 Replaced
TM
logo with logo
Page 1, 9, 11 & 22 Added 200MHz specification
Page 9 Tightened power numbers in DC Electrical Characteristics
Page 14 Changed waveforms to show INVALID operation if t
CO
< mnimumspecified
Page 1 - 22 Removed "Prelimnary" status
Page 9, 11 & 22 Designated 200Mhz speed grade available in BC-256 package only.
8/6/01:
11/20/01:
3/18/02:
12/4/02:
NOTES:
1. Available in BC-256 package only.
2. Industrial Temperature at 166Mhz not available in BF-208 package.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDT70V7319S166BCI | Photoelectric Sensor; Sensor Input Type:Optical; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sensor Housing:Rectangular; Turn Off Time:1ms; Turn On Time:1ms; Range:1.5" focal point |
| IDT70V7319S166BF | Photoelectric Sensor; Sensor Input Type:Optical; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sensor Housing:Rectangular; Turn Off Time:1ms; Turn On Time:1ms; Range:12" using 90% reflectance white card |
| IDT70V7319S166BFI | Photoelectric Sensor; Sensor Input Type:Optical; Sensing Range Max:24"; Sensor Housing:Rectangular; Turn Off Time:1ms; Turn On Time:1ms; Range:24" |
| IDT70V7319S166DD | Photoelectric Sensor; Sensor Input Type:Optical; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sensor Housing:Rectangular; Turn Off Time:10ms; Turn On Time:10ms; Range:6-ft using 90% reflectance white card |
| IDT70V7319S166DDI | Photoelectric Sensor; Sensor Input Type:Optical; Sensing Range Max:45m; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sensor Housing:Rectangular; Turn Off Time:1ms; Turn On Time:1ms |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IDT70V7319S166BC8 | 功能描述:IC SRAM 4MBIT 166MHZ 256BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S166BCGI | 功能描述:IC SRAM 4MBIT 166MHZ 256BGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S166BCI | 功能描述:IC SRAM 4MBIT 166MHZ 256BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S166BCI8 | 功能描述:IC SRAM 4MBIT 166MHZ 256BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S166BF | 功能描述:IC SRAM 4MBIT 166MHZ 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
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