參數(shù)資料
型號: IDT70T653MS10BCI
廠商: Integrated Device Technology, Inc.
英文描述: HIGH-SPEED 2.5V 512K x 36 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE
中文描述: 高速2.5V的為512k × 36 3.3 5011 2.5V的接口ASYNCHRONO美國雙端口靜態(tài)RAM
文件頁數(shù): 7/24頁
文件大小: 309K
代理商: IDT70T653MS10BCI
7
IDT70T653M Preliminary
High-Speed 2.5V 512K x 36 Asynchronous Dual-Port Static RAM Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(V
DD
= 2.5V ± 100mV)
NOTES:
1.
2.
3.
V
DDQ
is selectable (3.3V/2.5V) via OPT pins. Refer to page 6 for details.
Applicable only for TMS, TDI and
TRST
inputs.
Outputs tested in tri-state mode.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(3)
(V
DD
= 2.5V ± 100mV)
NOTES:
1. At f = f
MAX
, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/t
RC
, using "AC TEST CONDITIONS" at input
levels of GND to 3.3V.
2. f = 0 means no address or control lines change. Applies only to input at CMOS level standby.
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
4. V
DD
= 3.3V, T
A
= 25°C for Typ, and are not production tested. I
DD DC
(f=0)
= 200mA (Typ).
5.
CE
X
= V
IL
means
CE
0X
= V
IL
and CE
1X
= V
IH
CE
X
= V
IH
means
CE
0X
= V
IH
or CE
1X
= V
IL
CE
X
< 0.2V means
CE
0X
< 0.2V and CE
1X
> V
DDQX
- 0.2V
CE
X
> V
DDQX
- 0.2V means
CE
0X
> V
DDQX
- 0.2V or CE
1X
< 0.2V.
"X" represents "L" for left port or "R" for right port.
6. I
SB
1
, I
SB
2
and I
SB
4
will all reach full standby levels (I
SB
3
) on the appropriate port(s) if ZZ
L
and /or ZZ
R
= V
IH
.
70T653MS10
Com'l Only
70T653MS12
Com'l
& Ind
70T653MS15
Com'l Only
Symbol
Parameter
Test Condition
Version
Typ.
(4)
Max.
Typ.
(4)
Max.
Typ.
(4)
Max.
Unit
I
DD
Dynamic Operating
Current (Both
Ports Active)
CE
L
and
CE
R
= V
IL
,
Outputs Disabled
f = f
MAX
COM'L
S
600
810
600
710
450
600
mA
IND
S
____
____
600
790
____
____
I
SB1
(6)
Standby Current
(Both Ports - TTL
Level Inputs)
CE
L
=
CE
R
= V
IH
f = f
MAX
(1)
COM'L
S
180
240
150
210
120
170
mA
IND
S
____
____
150
260
____
____
I
SB2
(6)
Standby Current
(One Port - TTL
Level Inputs)
CE
"A"
= V
IL
and
CE
"B"
= V
IH
(5)
Active Port Outputs Disabled,
f = f
MAX
COM'L
S
400
530
360
460
300
400
mA
IND
S
____
____
360
510
____
____
I
SB3
Full Standby Current
(Both Ports - CMOS
Level Inputs)
Both Ports
CE
L
and
CE
R
> V
DD
- 0.2V, V
IN
> V
DD
- 0.2V
or V
IN
< 0.2V, f = 0
(2)
COM'L
S
4
20
4
20
4
20
mA
IND
S
____
____
4
40
____
____
I
SB4
(6)
Full Standby Current
(One Port - CMOS
Level Inputs)
CE
"A"
< 0.2V and
CE
"B"
> V
DD
- 0.2V
(5)
V
IN
> V
DD
- 0.2V or V
IN
< 0.2V, Active
Port, Outputs Disabled, f = f
MAX
(1)
COM'L
S
400
530
360
460
300
400
mA
IND
S
____
____
360
510
____
____
I
ZZ
Sleep Mode Current
(Both Ports - TTL
Level Inputs)
ZZ
L =
ZZ
R =
V
IH
f = f
MAX
(1)
COM'L
S
4
20
4
20
4
20
mA
IND
S
____
____
4
40
____
____
5679 tbl 10
Symbol
Parameter
Test Conditions
70T653M
Unit
Min.
Max.
|I
LI
|
Input Leakage Current
(1)
V
DDQ
= Max., V
IN
= 0V to V
DDQ
___
10
μA
|I
LI
|
JTAG & ZZ Input Leakage Current
(1,2)
V
DD =
Max.
,
V
IN
= 0V to V
DD
___
+60
μA
|I
LO
|
Output Leakage Current
(1,3)
CE
0
= V
IH
or CE
1
= V
IL
, V
OUT
= 0V to V
DDQ
___
10
μA
V
OL
(3.3V)
Output Low Voltage
(1)
I
OL
= +4mA, V
DDQ
= Min.
___
0.4
V
V
OH
(3.3V)
Output High Voltage
(1)
I
OH
= -4mA, V
DDQ
= Min.
2.4
___
V
V
OL
(2.5V)
Output Low Voltage
(1)
I
OL
= +2mA, V
DDQ
= Min.
___
0.4
V
V
OH
(2.5V)
Output High Voltage
(1)
I
OH
= -2mA, V
DDQ
= Min.
2.0
___
V
5679 tbl 09
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