參數(shù)資料
型號: IDT70T633S12DDI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: DRAM
英文描述: HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE
中文描述: 512K X 18 DUAL-PORT SRAM, 12 ns, PQFP144
封裝: 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
文件頁數(shù): 3/15頁
文件大?。?/td> 190K
代理商: IDT70T633S12DDI
6.42
IDT70V9379L
High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
11
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(3)
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(3)
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
3.
CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".
4. Addresses do not have to be accessed sequentially since
ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for
reference use only.
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
R/W
ADDRESS
An
An +1
An + 2
An + 3
An + 4
DATAIN
Dn + 2
CE0
CLK
4857 drw 12
Qn
DATAOUT
CE1
UB, LB
tCD1
Qn + 1
tCH1
tCL1
tCYC1
tSD tHD
tCD1
tDC
tCKHZ
Qn + 3
tCD1
tDC
tSC
tHC
tSB
tHB
tSW tHW
tSA
tHA
READ
NOP
READ
tCKLZ
(4)
(2)
(1)
tSW tHW
WRITE
(5)
R/W
ADDRESS
An
An +1
An + 2
An + 3
An + 4
An + 5
(4)
DATAIN
Dn + 2
CE0
CLK
4857 drw 13
Qn
DATAOUT
CE1
UB, LB
tCD1
tCH1
tCL1
tCYC1
tSD tHD
tCD1
tDC
Qn + 4
tCD1
tDC
tSC
tHC
tSB
tHB
tSW tHW
tSA
tHA
READ
WRITE
READ
tCKLZ
(2)
Dn + 3
tOHZ
(1)
tSW tHW
OE
tOE
相關(guān)PDF資料
PDF描述
IDT71F432L66PF 32k X 32 mcACHE synchronous pipelined cache ram
IDT71F432L75PF 32k X 32 mcACHE synchronous pipelined cache ram
IDT71V016SA12PH8 3.3V CMOS Static RAM 1 Meg (64K x 16-Bit)
IDT71V424S12PHG 3.3V CMOS STATIC RAM 4 MEG (512K x 8-BIT)
IDT71V424L12PHG 3.3V CMOS STATIC RAM 4 MEG (512K x 8-BIT)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT70T633S15BC 功能描述:IC SRAM 9MBIT 15NS 256BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70T633S15BC8 功能描述:IC SRAM 9MBIT 15NS 256BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70T633S15BF 功能描述:IC SRAM 9MBIT 15NS 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70T633S15BF8 功能描述:IC SRAM 9MBIT 15NS 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70T633S15DD 功能描述:IC SRAM 9MBIT 15NS 144TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ