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參數(shù)資料
| 型號： | IDT709199L12PFG |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | SRAM |
| 英文描述： | 128K X 9 DUAL-PORT SRAM, 25 ns, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 163K |
| 代理商： | IDT709199L12PFG |
6.42
IDT709199L
High-Speed 128K x 9 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
14
4847 drw 19
IDT709199
CE0
CE1
CE0
CE1
A17
CE1
CE0
VCC
IDT709199
Control Inputs
CNTRST
CLK
ADS
CNTEN
R/
W
OE
A Functional Description
The IDT709199 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold
times on address, data, and all critical control inputs. All internal
registers are clocked on the rising edge of the clock signal, however,
the self-timed internal write pulse is independent of the LOW to HIGH
transition of the clock signal.
An asynchronous output enable is provided to ease asynchronous
bus interfacing. Counter enable inputs are also provided to stall the
operation of the address counters for fast interleaved memory appli-
cations.
CE0 = VIH or CE1 = VIL for one clock cycle will power down the
internal circuitry to reduce static power consumption. Multiple chip
enables allow easier banking of multiple IDT709199's for depth
expansion configurations. When the Pipelined output mode is en-
abled, two cycles are required with
CE0 = VIL and CE1 = VIH to re-
activate the outputs.
Depth and Width Expansion
The IDT709199 features dual chip enables (refer to Truth Table I)
in order to facilitate rapid and simple depth expansion with no require-
ments for external logic. Figure 4 illustrates how to control the various
chip enables in order to expand two devices in depth.
The 709199 can also be used in applications requiring expanded
width, as indicated in Figure 4. Since the banks are allocated at the
discretion of the user, the external controller can be set up to drive the
input signals for the various devices as required to allow for 18-bit
or wider applications.
Figure 4. Depth and Width Expansion with IDT709199
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| IDT709199L7PF | 功能描述:IC SRAM 1.125MBIT 7NS 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| IDT709199L7PF8 | 功能描述:IC SRAM 1.125MBIT 7NS 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| IDT709199L9PF | 功能描述:IC SRAM 1.125MBIT 9NS 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| IDT709199L9PF8 | 功能描述:IC SRAM 1.125MBIT 9NS 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| IDT709199L9PFI | 功能描述:IC SRAM 1.125MBIT 9NS 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
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