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| 型號： | ICS874003AGT |
| 元件分類： | 時鐘及定時 |
| 英文描述： | 874003 SERIES, PLL BASED CLOCK DRIVER, 3 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封裝： | 6.50 X 4.40 MM, 0.92 MM HEIGHT, MO-153, TSSOP-20 |
| 文件頁數(shù)： | 12/12頁 |
| 文件大?。?/td> | 492K |
| 代理商： | ICS874003AGT |
Integrated
Circuit
Systems, Inc.
874003AG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
9
ICS874003
PCI EXPRESS
JITTER ATTENUATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS874003.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS874003 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (85mA + 15mA) = 294.52mW
Power (outputs)
MAX = VDDO_MAX * IDDO_MAX = 3.465V * 110mA = 381.15mW
Total Power
_MAX = 294.52mW + 381.15mW = 675.67mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
q
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per
Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.675W * 66.6°C/W = 114.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-LEAD TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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| ICS874003DG-02LF | 功能描述:IC PCI EXPRSS/JITT ATTEN 20TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 專用 系列:HiPerClockS™, FemtoClock™, PCI Express® (PCIe) 標準包裝:1,500 系列:- 類型:時鐘緩沖器/驅(qū)動器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
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