參數(shù)資料
型號(hào): ICS84329BYT
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類(lèi): 時(shí)鐘產(chǎn)生/分配
英文描述: 700 MHz, OTHER CLOCK GENERATOR, PQFP32
封裝: 7 X 7 MM, 1.40 MM HEIGHT, MS-026BBC-HD, LQFP-32
文件頁(yè)數(shù): 5/21頁(yè)
文件大小: 2417K
代理商: ICS84329BYT
ICS84329B
700MHZ, LOW JITTER, CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
IDT / ICS LVPECL FREQUENCY SYNTHESIZER
13
ICS84329BV REV. B DECEMBER 20, 2007
The following component footprints are used in this layout
example:
All the resistors and capacitors are size 0603.
Power and Grounding
Place the decoupling capacitors C1, C2 and C3, as close as
possible to the power pins. If space allows, placement of the
decoupling capacitor on the component side is preferred. This can
reduce unwanted inductance between the decoupling capacitor
and the power pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power and
ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed as
close to the V
CCA pin as possible.
Clock Traces and Termination
Poor signal integrity can degrade the system performance or cause
system failure. In synchronous high-speed digital systems, the
clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
The differential 50
output traces should have the same
length.
Avoid sharp angles on the clock trace. Sharp angle turns
cause the characteristic impedance to change on the
transmission lines.
Keep the clock traces on the same layer. Whenever
possible, avoid placing vias on the clock traces. Placement of
vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace widths
between the differential clock trace and the other signal trace.
Make sure no other signal traces are routed between the
clock trace pair.
The matching termination resistors should be located as
close to the receiver input pins as possible.
Crystal
The crystal X1 should be located as close as possible to the pins
4 (XTAL_IN) and 5 (XTAL_OUT). The trace length between the X1
and U1 should be kept to a minimum to avoid unwanted parasitic
inductance and capacitance. Other signal traces should not be
routed near the crystal traces.
Figure 7B. ICS84329B PCB Board Layout for ICS84329B 28 Lead PLCC
C3
C1
X1
VCC
C16
C4
PIN 1
C2
Signals
Traces
C11
GND
R7
U1
PIN 2
VCCA
VIA
VCCA
50 Ohm
Traces
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