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參數(shù)資料
| 型號： | ICS84320AK-01LF |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 6/22頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SYNTHESIZER 780MHZ 32-VFQFPN |
| 標(biāo)準(zhǔn)包裝： | 490 |
| 系列： | HiPerClockS™ |
| 類型： | 頻率合成器 |
| PLL： | 帶旁路 |
| 輸入： | 晶體 |
| 輸出： | LVPECL |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:2 |
| 差分 - 輸入:輸出： | 無/是 |
| 頻率 - 最大： | 780MHz |
| 除法器/乘法器： | 是/無 |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-VFQFPN 裸露焊盤（4x4） |
| 包裝： | 托盤 |
| 其它名稱： | 84320AK-01LF |
84320AY-01
www.idt.com
REV. D JULY 26, 2010
14
ICS84320-01
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
FIGURE 7. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
VFQFN EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the
footprint of the package corresponding to the exposed metal
pad or exposed heat slug on the package, as shown in Figure
7. The solderable area on the PCB, as defined by the solder
mask, should be at least the same size/shape as the exposed
pad/slug area on the package to maximize the thermal/
electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land
pattern and the inner edges of pad pattern for the leads to
avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s).
The land pattern must be connected to ground through these
vias. The vias act as “heat pipes”. The number of vias (i.e.
“heat pipes”) are application specific and dependent upon
the package power dissipation as well as electrical
conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the
minimum number needed. Maximum thermal and electrical
performance is achieved when an array of vias is incorporated
in the land pattern. It is recommended to use as many vias
connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with
1oz copper via barrel plating. This is desirable to avoid any
solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed
pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug
and the land pattern. Note: These recommendations are to be
used as a guideline only. For further information, refer to the
Application Note on the Surface Mount Assembly of Amkor’s
Thermally/Electrically Enhance Leadfame Base Package,
Amkor Technology.
THERMAL VIA
LAND PATTERN
SOLDER
PIN
SOLDER
PIN PAD
PIN
GROUND PLANE
EXPOSED HEAT SLUG
(GROUND PAD)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ICS84320AK-01LFT | 功能描述:IC SYNTHESIZER 780MHZ 32-VFQFPN RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:時(shí)鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱:844S012AKI-01LFT |
| ICS84320AK-01T | 制造商:ICS 制造商全稱:ICS 功能描述:780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER |
| ICS84320AY-01 | 制造商:ICS 制造商全稱:ICS 功能描述:780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER |
| ICS84320AY-01LN | 功能描述:IC SYNTHESIZER GP LVPECL 32-LQFP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:時(shí)鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱:844S012AKI-01LFT |
| ICS84320AY-01LNT | 功能描述:IC SYNTHESIZER 780MHZ 32-LQFP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:時(shí)鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱:844S012AKI-01LFT |
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