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參數(shù)資料
| 型號： | ICS843003AGT |
| 英文描述： | FEMTOCLOCKS CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER |
| 中文描述： | FEMTOCLOCKS晶體到3.3的LVPECL頻率合成器 |
| 文件頁數(shù)： | 5/17頁 |
| 文件大?。?/td> | 295K |
| 代理商： | ICS843003AGT |
843003AG
www.icst.com/products/hiperclocks.html
REV. A JULY 27, 2004
13
Integrated
Circuit
Systems, Inc.
ICS843003
FEMTOCLOCKSCRYSTAL-TO-3.3V LVPECL
FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843003.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843003 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 158mA = 547.5mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 3 * 30mW = 90mW
Total Power
_MAX (3.465V, with all outputs switching) = 547.5mW + 90mW = 637.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.638W * 65°C/W = 111.5°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 8. THERMAL RESISTANCE
θθθθθ
JA
FOR
24-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
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| ICS843003AI01 | 制造商:ICS 制造商全稱:ICS 功能描述:FEMTOCLOCKS-TM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER |
| ICS843003I-01 | 制造商:ICS 制造商全稱:ICS 功能描述:FEMTOCLOCKS-TM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER |
| ICS843003I-09 | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:FEMTOCLOCKS? CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER |
| ICS843004 | 制造商:ICS 制造商全稱:ICS 功能描述:FEMTOCLOCKS⑩ LVCMOS/CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER |
| ICS843004-01 | 制造商:ICS 制造商全稱:ICS 功能描述:FEMTOCLOCKS-TM CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER |
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