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參數(shù)資料
| 型號： | ICS83940DYI-01LFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 6/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CLOCK BUFFER MUX 2:18 32-LQFP |
| 標準包裝： | 1,000 |
| 系列： | HiPerClockS™ |
| 類型： | 扇出緩沖器（分配），多路復(fù)用器 |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 2:18 |
| 差分 - 輸入:輸出： | 是/無 |
| 輸入： | CML，LVCMOS，LVPECL，LVTTL，SSTL |
| 輸出： | LVCMOS，LVTTL |
| 頻率 - 最大： | 250MHz |
| 電源電壓： | 2.375 V ~ 3.465 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-LQFP |
| 供應(yīng)商設(shè)備封裝： | 32-TQFP（7x7） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 83940DYI-01LFT |
ICS83940DYI-01 REVISION A SEPTEMBER 27, 2010
14
2010 Integrated Device Technology, Inc.
ICS83940I-01 Data Sheet
LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS83940DI-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS83940DI-01 is the sum of the core power plus the power dissipated in the load(s). The following is the
power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)MAX = VDD_MAX * (IDD + IDDO) = 3.465V *(26mA + 28mA) = 187.11mW
Dynamic Power Dissipation at 175MHz
Power (175MHz) = CPD * Frequency * (VDD)
2 * number of outputs = 9pF * 175MHz * (3.465V)2 * 18 = 340.4mW
Total Power Dissipation
Total Power
= Power (core)MAX + Power (175MHz)
= 187.15mW + 340.4mW
= 527.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 53.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.528W * 53.5°C/W = 113.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will vary depending on the number of loaded outputs, supply voltage, air flow and the type of board
(multi-layer).
Table 6. Thermal Resistance θJA for 32 Lead LQFP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
53.5°C/W
48.0°C/W
44.0°C/W
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ICS83940DYI-01T | 制造商:ICS 制造商全稱:ICS 功能描述:LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS / LVTTL FANOUT BUFFER |
| ICS83940DYILF | 功能描述:IC CLOCK BUFFER MUX 2:18 32-LQFP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅(qū)動器 系列:HiPerClockS™ 產(chǎn)品培訓模塊:High Bandwidth Product Overview 標準包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ICS83940DYILFT | 功能描述:IC CLOCK BUFFER MUX 2:18 32-LQFP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘緩沖器，驅(qū)動器 系列:HiPerClockS™ 標準包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:32-QFN（5x5） 包裝:管件 |
| ICS83940DYIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 2:18 250MHZ 32TQFP |
| ICS83940DYI-T | 制造商:ICS 制造商全稱:ICS 功能描述:LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS / LVTTL FANOUT BUFFER |
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