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ICS650-07B
Broadcom Clock Source
MD S 650-07B A
Integrated Circuit Systems, Inc. 525 Race Street San Jose CA 95126(408)295-9800tel www.icst.com
3
Revision 042600
Printed 11/15/00
Parameter
ABSOLUTE MAXIMUM RATINGS (note 1)
Supply voltage, VDD
Inputs and Clock Outputs
Ambient Operating Temperature
Soldering Temperature
Storage temperature
DC CHARACTERISTICS (VDD = 3.3 V unless noted)
Operating Voltage, VDD
Input High Voltage, VIH, X1 pin only
Input Low Voltage, VIL, X1 pin only
Input High Voltage, VIH, PS pin only
Input Low Voltage, VIL, PS pin only
Output High Voltage, VOH
Output Low Voltage, VOL
Output High Voltage, VOH, CMOS level
Operating Supply Current, IDD
Short Circuit Current
Internal pull-up resistor
AC CHARACTERISTICS (VDD = 3.3 V unless noted)
Input Frequency
Output Clock Rise Time
Output Clock Fall Time
Output Clock Duty Cycle
Frequency error
Absolute Jitter, short term
Conditions
Minimum
Typical
Maximum
Units
Referenced to GND
Referenced to GND
7
V
V
°C
°C
°C
-0.5
0
VDD+0.5
70
260
150
Max of 20 seconds
-65
3
5.5
V
V
V
V
V
V
V
V
VDD/2 + 1
VDD/2
VDD/2
VDD/2 - 1
VDD-0.5
0.5
IOH=-12 mA
IOL=12 mA
IOH=-4 mA
No Load
Each output
PS, OE
2.4
0.4
VDD-0.4
35
±50
200
mA
mA
k
25.000
MH z
ns
ns
%
ppm
ps
0.8 to 2.0 V
2.0 to 0.8 V
At VDD/2
All clocks
Variation from mean
1.5
1.5
60
0
40
50
±200
Electrical Specifications
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged
exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.
External Components
The ICS650-07B requires a minimum number of external components for proper operation. Decoupling
capacitors of 0.01μF should be connected between each VDD and GND, as close to the ICS650-07B as
possible. A series termination resistor of 33
may be used for each clock output. The 25.00 MHz crystal
must be connected as close to the chip as possible. The crystal should be a fundamental mode (do not use
third overtone), parallel resonant. Crystal capacitors should be connected from pins X1 to ground and X2
to ground to optimize the initial accuracy. The value of these capacitors is given by the following equation,
where C
L
is the crystal load capacitance: Crystal caps (pF) = (C
L
-6) x 2. So for a crystal with 16 pF load
capacitance, two 20 pF caps should be used.